{"title":"使用喷墨打印结构的温度传感","authors":"E. Gieva, G. Nikolov, B. Nikolova, I. Ruskova","doi":"10.1109/ET.2019.8878639","DOIUrl":null,"url":null,"abstract":"In the present publication we have investigated the temperature dependence of a resistive structure printed with Inkjet technology. We have also investigated the change of impedance with heating in a thermo-chamber and its change at cooling. The results obtained are described and analysed to determine the influence of temperature sintering on the properties of the printed layers as well as to find application of the structures as sensing elements.","PeriodicalId":306452,"journal":{"name":"2019 IEEE XXVIII International Scientific Conference Electronics (ET)","volume":"71 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2019-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Temperature Sensing with Inkjet Printed Structures\",\"authors\":\"E. Gieva, G. Nikolov, B. Nikolova, I. Ruskova\",\"doi\":\"10.1109/ET.2019.8878639\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In the present publication we have investigated the temperature dependence of a resistive structure printed with Inkjet technology. We have also investigated the change of impedance with heating in a thermo-chamber and its change at cooling. The results obtained are described and analysed to determine the influence of temperature sintering on the properties of the printed layers as well as to find application of the structures as sensing elements.\",\"PeriodicalId\":306452,\"journal\":{\"name\":\"2019 IEEE XXVIII International Scientific Conference Electronics (ET)\",\"volume\":\"71 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2019-09-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2019 IEEE XXVIII International Scientific Conference Electronics (ET)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ET.2019.8878639\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 IEEE XXVIII International Scientific Conference Electronics (ET)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ET.2019.8878639","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Temperature Sensing with Inkjet Printed Structures
In the present publication we have investigated the temperature dependence of a resistive structure printed with Inkjet technology. We have also investigated the change of impedance with heating in a thermo-chamber and its change at cooling. The results obtained are described and analysed to determine the influence of temperature sintering on the properties of the printed layers as well as to find application of the structures as sensing elements.