使用喷墨打印结构的温度传感

2019 IEEE XXVIII International Scientific Conference Electronics (ET) Pub Date : 2019-09-01 DOI:10.1109/ET.2019.8878639

E. Gieva, G. Nikolov, B. Nikolova, I. Ruskova

{"title":"使用喷墨打印结构的温度传感","authors":"E. Gieva, G. Nikolov, B. Nikolova, I. Ruskova","doi":"10.1109/ET.2019.8878639","DOIUrl":null,"url":null,"abstract":"In the present publication we have investigated the temperature dependence of a resistive structure printed with Inkjet technology. We have also investigated the change of impedance with heating in a thermo-chamber and its change at cooling. The results obtained are described and analysed to determine the influence of temperature sintering on the properties of the printed layers as well as to find application of the structures as sensing elements.","PeriodicalId":306452,"journal":{"name":"2019 IEEE XXVIII International Scientific Conference Electronics (ET)","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2019-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Temperature Sensing with Inkjet Printed Structures\",\"authors\":\"E. Gieva, G. Nikolov, B. Nikolova, I. Ruskova\",\"doi\":\"10.1109/ET.2019.8878639\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In the present publication we have investigated the temperature dependence of a resistive structure printed with Inkjet technology. We have also investigated the change of impedance with heating in a thermo-chamber and its change at cooling. The results obtained are described and analysed to determine the influence of temperature sintering on the properties of the printed layers as well as to find application of the structures as sensing elements.\",\"PeriodicalId\":306452,\"journal\":{\"name\":\"2019 IEEE XXVIII International Scientific Conference Electronics (ET)\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2019-09-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2019 IEEE XXVIII International Scientific Conference Electronics (ET)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ET.2019.8878639\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 IEEE XXVIII International Scientific Conference Electronics (ET)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ET.2019.8878639","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 1

摘要

在本出版物中，我们研究了用喷墨技术印刷的电阻结构的温度依赖性。我们还研究了热室中随加热和冷却时阻抗的变化。对得到的结果进行了描述和分析，以确定温度烧结对打印层性能的影响，并寻找该结构作为传感元件的应用。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文本刊更多论文

Temperature Sensing with Inkjet Printed Structures

In the present publication we have investigated the temperature dependence of a resistive structure printed with Inkjet technology. We have also investigated the change of impedance with heating in a thermo-chamber and its change at cooling. The results obtained are described and analysed to determine the influence of temperature sintering on the properties of the printed layers as well as to find application of the structures as sensing elements.

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

2019 IEEE XXVIII International Scientific Conference Electronics (ET)

自引率

0.00%

发文量