铁电氧化铪:FRAM的颠覆者?

J. Muller, P. Polakowski, S. Riedel, S. Mueller, E. Yurchuk, T. Mikolajick
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引用次数: 14

摘要

本文评估了氧化铪作为cmos兼容铁电材料在未来存储器应用中的潜力。铁电氧化铪的高矫顽力场强是影响器件性能的关键参数。它提供了这种新型铁电材料的独特厚度和横向结垢潜力,同时由于大开关场而损害了其持久性能。考虑到该参数的矛盾性质,以及在保持和持久之间出现的权衡,讨论了电压控制的工作模式和铁电氧化铪的不同器件概念。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Ferroelectric Hafnium Oxide A Game Changer to FRAM?
In this paper the potential of hafnium oxide as a CMOS-compatible ferroelectric for future memory applications is assessed. The high coercive field strength of ferroelectric hafnium oxide is identified as a key parameter being crucial to device performance. It provides the unique thickness and lateral scaling potential of this novel ferroelectric, while at the same time compromises its endurance properties due to large switching fields. Considering the ambivalent nature of this parameter as well as the emerging trade-off between retention and endurance, voltage controlled operation modes and different device concepts for ferroelectric hafnium oxide are discussed.
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