用于C.A.D.的半导体层共面线的台式计算机模型

R. Delrue, C. Seguinot, P. Pribetich, P. Kennis
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引用次数: 1

摘要

在CAD仿真中,有必要确定铺在半导体衬底上的共面线的频率特性。精确的分析可以通过使用诸如S.D.A.或模式匹配等数值技术来执行。然而,这样的分析不能包括在C.A.D.项目中。为此,我们提出了一个考虑金属化厚度和介电帽层影响的半导体衬底共面线的原始模型。通过与模式匹配和S.D.A.结果的比较,验证了模型的有效性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Desktop Computer Models for Coplanar Lines Laid on Semiconductor Layers for C.A.D.
For CAD simulation, it is necessary to determine the frequency behaviour of coplanar lines laid on semiconductor substrates. Exact analysis can be performed by using numerical technics such as S.D.A. or Mode Matching. However such analysis can not be included in C.A.D. programs. For this purpose, we present an original model for coplanar lines laid on semiconductor substrates, which take into account both the influence of thickness metallization and dielectric cap layer. The validity of our models is tested by comparison with mode matching and S.D.A. results.
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