{"title":"厚光刻胶三维光刻制备电镀三维微线圈的新方法","authors":"J.-B. Yoon, Chul‐Hi Han, E. Yoon, C. kim","doi":"10.1109/IMNC.1998.729981","DOIUrl":null,"url":null,"abstract":"ed a novel and high-yield process to fabricate electroplated 3D microI concept as shown in Figure 1, we decompose the 3D micro-coil, which integrated inductor in other words, into two parts, the bottom conductor bridges, and form the single-body air bridges during only one his does not mean the air bridges are made by the conventional way, f posts (or vias) and upper conductor lines vertically, and hence is a","PeriodicalId":356908,"journal":{"name":"Digest of Papers. Microprocesses and Nanotechnology'98. 198 International Microprocesses and Nanotechnology Conference (Cat. No.98EX135)","volume":"191 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1998-07-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Novel Fabrication Of Electroplated 3D Micro-Coils Using 3D Photolithography Of Thick Photoresist\",\"authors\":\"J.-B. Yoon, Chul‐Hi Han, E. Yoon, C. kim\",\"doi\":\"10.1109/IMNC.1998.729981\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"ed a novel and high-yield process to fabricate electroplated 3D microI concept as shown in Figure 1, we decompose the 3D micro-coil, which integrated inductor in other words, into two parts, the bottom conductor bridges, and form the single-body air bridges during only one his does not mean the air bridges are made by the conventional way, f posts (or vias) and upper conductor lines vertically, and hence is a\",\"PeriodicalId\":356908,\"journal\":{\"name\":\"Digest of Papers. Microprocesses and Nanotechnology'98. 198 International Microprocesses and Nanotechnology Conference (Cat. No.98EX135)\",\"volume\":\"191 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1998-07-13\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Digest of Papers. Microprocesses and Nanotechnology'98. 198 International Microprocesses and Nanotechnology Conference (Cat. No.98EX135)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IMNC.1998.729981\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Digest of Papers. Microprocesses and Nanotechnology'98. 198 International Microprocesses and Nanotechnology Conference (Cat. No.98EX135)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IMNC.1998.729981","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Novel Fabrication Of Electroplated 3D Micro-Coils Using 3D Photolithography Of Thick Photoresist
ed a novel and high-yield process to fabricate electroplated 3D microI concept as shown in Figure 1, we decompose the 3D micro-coil, which integrated inductor in other words, into two parts, the bottom conductor bridges, and form the single-body air bridges during only one his does not mean the air bridges are made by the conventional way, f posts (or vias) and upper conductor lines vertically, and hence is a
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