轧制(110)[001]铜单晶的组织与织构

M. Wróbel, S. Dymek, M. Blicharski, S. Gorczyca
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引用次数: 9

摘要

位错结构没有不均匀性,在变形材料中通常观察到高取向变化。在细胞背景下减少20%和40%后,有时会观察到条带(位错丰富的层)。随着应变的增加,晶胞结构变得模糊,而富含位错的层变得更加尖锐(还原60%后,没有出现位错晶胞)。在靠近试样轧制表面的层中,位错带几乎与RD平行,并且比其他层中的位错带薄得多。SAD分析表明,在表层,晶体取向随着从表面到试样中心的距离(绕ND旋转)的增加而系统地发生变化。在中间层中,位错带呈弯曲状并与其他位错带重叠。尽管进行了详细的调查,但即使在轧制至95%还原的试样中也没有观察到剪切带。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Microstructure and Texture of Rolled (110)[001] Copper Single Crystals
The dislocation structure was free from inhomogeneities with high orientation changes normally observed in deformed materials. After reductions 20% and 40% against the background of cells there were sometimes observed bands (dislocation rich layers). With increasing strain the cell structure became faint and the dislocation rich layers became sharper (after 60% reduction no dislocation cells were revealed). It has been found, that in layers lying close to the rolled surface of the specimen the dislocation bands were nearly parallel to the RD and much thinner than those in further layers. SAD analysis indicate that in the surface layers the crystallographic orientation changed systematically with increasing distance from the surface to the center of the specimen (rotation around ND). In the intermediate layers the dislocation bands were curved and overlapped the other dislocation bands. Despite of detailed investigation shear bands were not observed even in specimens rolled to the 95% reduction.
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