集成电路版图二维符号压缩的新方法

Y. Cheng, R. Fujii
{"title":"集成电路版图二维符号压缩的新方法","authors":"Y. Cheng, R. Fujii","doi":"10.1109/HICSS.1989.47138","DOIUrl":null,"url":null,"abstract":"A method for two-dimensional IC symbolic layout compaction is presented. Distances between the layout elements and the selected origin are minimized to achieve a compacted layout. Compared to one-dimensional compaction, this algorithm gets better results and its time complexity is of the same order.<<ETX>>","PeriodicalId":300182,"journal":{"name":"[1989] Proceedings of the Twenty-Second Annual Hawaii International Conference on System Sciences. Volume 1: Architecture Track","volume":"283 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1989-01-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"A new method for two dimensional symbolic compaction of IC layout\",\"authors\":\"Y. Cheng, R. Fujii\",\"doi\":\"10.1109/HICSS.1989.47138\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A method for two-dimensional IC symbolic layout compaction is presented. Distances between the layout elements and the selected origin are minimized to achieve a compacted layout. Compared to one-dimensional compaction, this algorithm gets better results and its time complexity is of the same order.<<ETX>>\",\"PeriodicalId\":300182,\"journal\":{\"name\":\"[1989] Proceedings of the Twenty-Second Annual Hawaii International Conference on System Sciences. Volume 1: Architecture Track\",\"volume\":\"283 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1989-01-03\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"[1989] Proceedings of the Twenty-Second Annual Hawaii International Conference on System Sciences. Volume 1: Architecture Track\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/HICSS.1989.47138\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"[1989] Proceedings of the Twenty-Second Annual Hawaii International Conference on System Sciences. Volume 1: Architecture Track","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/HICSS.1989.47138","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

摘要

提出了一种二维集成电路符号布局压缩方法。布局元素与选定原点之间的距离被最小化,以实现紧凑的布局。与一维压缩相比,该算法的压缩效果更好,且时间复杂度相同。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A new method for two dimensional symbolic compaction of IC layout
A method for two-dimensional IC symbolic layout compaction is presented. Distances between the layout elements and the selected origin are minimized to achieve a compacted layout. Compared to one-dimensional compaction, this algorithm gets better results and its time complexity is of the same order.<>
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