电源IGBT模块热力学性能及可靠性仿真

2022 14th International Conference on Advanced Semiconductor Devices and Microsystems (ASDAM) Pub Date : 2022-10-23 DOI:10.1109/ASDAM55965.2022.9966740

F. Koval, A. Chvála

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引用次数: 0

摘要

本文介绍了一种用于模拟功率IGBT器件和模块的热机械性能和可靠性的方法。本文在商业仿真软件的支持下，对现代IGBT模块和器件进行了结果分析和设计优化。在实际应用中，这些模拟可以代替昂贵和长期的实验工作，以提高这些部件的热力学参数，可靠性和使用寿命。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Simulation of Thermo Mechanical Properties and Reliability of Power IGBT Module

This paper describes a proposed methodology for simulation of thermomechanical properties and reliability of power IGBT devices and modules. This paper consists of an analysis of the results and design optimization of modern IGBT modules and devices with commercial simulation software support. In practice, these simulations can replace expensive and protracted experimental works in an effort to improve thermomechanical parameters, reliability and operating life time of these components.

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来源期刊

2022 14th International Conference on Advanced Semiconductor Devices and Microsystems (ASDAM)

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