采用晶圆键合封装的窄触隙可靠RF-MEMS压电开关

T. Nakatani, T. Katsuki, H. Okuda, O. Toyoda, S. Ueda, F. Nakazawa
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引用次数: 1

摘要

提出了一种低成本封装、可靠的压电驱动RF-MEMS移动通信开关。我们在SOI晶圆上制造了一种刚性单晶硅(SCS)光束,该光束具有致动器和接触凸点,没有背面蚀刻。我们将晶圆粘合到陶瓷帽晶圆上,直接封装了一个接触间隙为0.5 μm的开关,而不使用牺牲层。在20v驱动电压下,开关工作高达10亿次,保持低插入损耗(< 0.4 dB,高达5GHz)。表面贴装的SPST开关尺寸为1.6 × 1.1 × 0.8 mm。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Piezoelectric reliable RF-MEMS switch with narrow contact-gap using wafer-bond packaging
This paper presents a low-cost packaged and reliable piezoelectric-actuated RF-MEMS switch for mobile communications. We fabricated a stiff single crystal silicon (SCS) beam that has an actuator and a contact bump on an SOI wafer without backside etching. We bonded the wafer to a ceramic cap wafer, directly packaging a switch with a contact gap of 0.5-μm not using sacrificial layers. The switch operated up to 1 billion cycles keeping a low insertion loss (<;0.4 dB up to 5GHz) at 20-V driving voltage. The surface mountable SPST switch was 1.6 × 1.1 × 0.8 mm in size.
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