{"title":"基于数据流分析的数字集成电路物理设计分区级平面图方法","authors":"Yinan Zhang, Xiaohong Peng","doi":"10.1109/ICAM.2017.8242141","DOIUrl":null,"url":null,"abstract":"This paper presents a partition level floorplan method for physical design of digital integrated circuit, which based on data flow analysis. It uses Cadence company P&R tool innovus to make floorplan, and takes a X86 CPU's south bridge design for example to introduce how to use this method to guide floorplan in detail. This method is more effective to improve the quality of floorplan for advanced process technology and high speed IC design.","PeriodicalId":117801,"journal":{"name":"2017 2nd IEEE International Conference on Integrated Circuits and Microsystems (ICICM)","volume":"145 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2017-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"A partition level floorplan method based on data flow analysis for physical design of digital IC\",\"authors\":\"Yinan Zhang, Xiaohong Peng\",\"doi\":\"10.1109/ICAM.2017.8242141\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper presents a partition level floorplan method for physical design of digital integrated circuit, which based on data flow analysis. It uses Cadence company P&R tool innovus to make floorplan, and takes a X86 CPU's south bridge design for example to introduce how to use this method to guide floorplan in detail. This method is more effective to improve the quality of floorplan for advanced process technology and high speed IC design.\",\"PeriodicalId\":117801,\"journal\":{\"name\":\"2017 2nd IEEE International Conference on Integrated Circuits and Microsystems (ICICM)\",\"volume\":\"145 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2017-11-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2017 2nd IEEE International Conference on Integrated Circuits and Microsystems (ICICM)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICAM.2017.8242141\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2017 2nd IEEE International Conference on Integrated Circuits and Microsystems (ICICM)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICAM.2017.8242141","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
A partition level floorplan method based on data flow analysis for physical design of digital IC
This paper presents a partition level floorplan method for physical design of digital integrated circuit, which based on data flow analysis. It uses Cadence company P&R tool innovus to make floorplan, and takes a X86 CPU's south bridge design for example to introduce how to use this method to guide floorplan in detail. This method is more effective to improve the quality of floorplan for advanced process technology and high speed IC design.