使用频域成像的更高分辨率声学图像

Proceedings of the 10th International Symposium on the Physical and Failure Analysis of Integrated Circuits. IPFA 2003 Pub Date : 2003-07-07 DOI:10.1109/IPFA.2003.1222747

J. Semmens, L. W. Kessler

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引用次数: 5

摘要

在晶圆键合、倒装芯片和MEMS等应用中，FFT频域成像已被用于显示厚度仅为埃的特征，这大大低于分辨率的可接受波长限制。

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Higher resolution acoustic images using frequency domain imaging

FFT frequency domain imaging has been used to reveal features down to only Angstroms in thickness, which is substantially below the accepted wavelength limit of the resolution, in applications such as wafer bonding, flip chips, and MEMS.

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Proceedings of the 10th International Symposium on the Physical and Failure Analysis of Integrated Circuits. IPFA 2003

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