A Post-Bond TSVs Test Solution for Leakage Fault

During the 3-D ICs manufacturing process, TSVs are susceptible to undergo different faults. Among these faults, the leakage fault is one of the most common cases. In this paper, a new test structure based on the improved ring oscillator circuit is proposed to detect the TSV leakage fault. An accurate TSV leakage fault model extracted from three-dimensional full-wave simulation is adopted in the test structure. HSPICE Monte Carlo simulation shows that the proposed test structure can detect the weak leakage faults with no less than 0.2025um2 pin-hole area, which is a larger coverage compared with the traditional test structure.