亚微米CMOS技术中的热载流子降解和ESD:它们是如何相互作用的?

G. Groeseneken
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引用次数: 13

摘要

本文综述了晶体管中通道热载流子(CHC)引起的劣化现象及其与ESD可靠性的关系。讨论了从通道/漏极工程开始的技术开发过程中CHC的原理和与ESD的权衡,包括对混合电压设计的考虑。此外,还考虑了由静电诱导的CHC效应引起的潜在损伤。最后,展示了热载流子的产生如何有助于优化先进ESD保护概念的性能。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Hot carrier degradation and ESD in submicron CMOS technologies: how do they interact?
In this paper, the phenomenon of channel hot carrier (CHC) induced degradation in transistors and its relation to ESD reliability is reviewed. The principles of CHC and the trade-off with ESD during technology development from channel/drain engineering, including consideration for mixed voltage designs, are discussed. Also, latent damage due to ESD-induced effects on CHC are considered. Finally, it is shown how the generation of hot carriers can help in the optimization of the performance of advanced ESD protection concepts.
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