3nm技术节点上垂直堆叠的硅纳米片场效应晶体管

Tara Prasanna Dash, S. Dey, E. Mohapatra, S. Das, J. Jena, C. K. Maiti
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引用次数: 9

摘要

本文首次研究了垂直堆叠硅纳米片fet (sns - fet)在3nm技术节点上的极限缩放的可行性,作为继续提高CMOS技术性能的可能解决方案之一。随着快乐缩放时代的结束,器件架构的变化提高了集成复杂性,并带来了多种通道效应、迁移率下降、可变性和量子隧道泄漏。这些都是主要的挑战,因为设备尺寸的缩放是为了达到7nm技术节点以下的最终缩放。为了实现低功耗和高速度(超过摩尔应用),纳米线和纳米片晶体管正在被提出。今天,FinFET的降尺度问题仍然是开放的,并且比以往任何时候都有更多的CMOS晶体管替代品,例如垂直堆叠的sns - fet显示出超越FinFET的潜力。在这项工作中,我们使用三维预测模拟来研究sns - fet在3nm技术节点上的性能潜力。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Vertically-Stacked Silicon Nanosheet Field Effect Transistors at 3nm Technology Nodes
Feasibility of vertically-stacked silicon nanosheet FETs (SNS-FETs) for extreme scaling at 3nm technology node are investigated for the first time as one of the possible solutions to continue to enhance the performances of the CMOS technology. With the end of happy scaling era, change of device architecture has raised integration complexity along with several sort channel effects, mobility degradation, variability and quantum tunneling leakage. These are the major challenges as device dimensions are scaled for ultimate scaling below 7nm technology nodes. Towards low power and high speed (More-than-Moore applications), nanowires and nanosheet transistors are being proposed. Today, the question of FinFET downscaling is still open and more than ever alternatives to CMOS transistors, such as, vertically-stacked SNS-FETs are showing their potential to surpass the FinFETs. In this work, we use 3-D predictive simulations to study the performance potential of SNS-FETs at 3nm technology node.
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