{"title":"60 ghz天线封装技术","authors":"Y. Zhang","doi":"10.1109/EDAPS.2009.5404009","DOIUrl":null,"url":null,"abstract":"This paper present a summary of the development of Antenna-in-Package (AiP) technology in a low-temperature co-fired ceramic (LTCC) process for highly-integrated 60-GHz radios. The AiP exploits the LTCC capability to integrate the antenna and package functions into a compact three-dimensional structure of size 12.5×8×1.265 mm3. The antenna consists of a radiator, a ground plane, and a guard ring. It is shown that our AiP designs achieve excellent antenna performance in the 60-GHz band with an estimated efficiency better than 90%. Simulated and measured impedance and radiation results are compared. They agree reasonably well, indicating that the challenge in the antenna technology for low-power high-speed 60-GHz wireless communications has been solved.","PeriodicalId":370741,"journal":{"name":"2009 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS)","volume":"30 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2009-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"60-GHz Antenna-in-Package technology\",\"authors\":\"Y. Zhang\",\"doi\":\"10.1109/EDAPS.2009.5404009\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper present a summary of the development of Antenna-in-Package (AiP) technology in a low-temperature co-fired ceramic (LTCC) process for highly-integrated 60-GHz radios. The AiP exploits the LTCC capability to integrate the antenna and package functions into a compact three-dimensional structure of size 12.5×8×1.265 mm3. The antenna consists of a radiator, a ground plane, and a guard ring. It is shown that our AiP designs achieve excellent antenna performance in the 60-GHz band with an estimated efficiency better than 90%. Simulated and measured impedance and radiation results are compared. They agree reasonably well, indicating that the challenge in the antenna technology for low-power high-speed 60-GHz wireless communications has been solved.\",\"PeriodicalId\":370741,\"journal\":{\"name\":\"2009 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS)\",\"volume\":\"30 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2009-12-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2009 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EDAPS.2009.5404009\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2009 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EDAPS.2009.5404009","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
This paper present a summary of the development of Antenna-in-Package (AiP) technology in a low-temperature co-fired ceramic (LTCC) process for highly-integrated 60-GHz radios. The AiP exploits the LTCC capability to integrate the antenna and package functions into a compact three-dimensional structure of size 12.5×8×1.265 mm3. The antenna consists of a radiator, a ground plane, and a guard ring. It is shown that our AiP designs achieve excellent antenna performance in the 60-GHz band with an estimated efficiency better than 90%. Simulated and measured impedance and radiation results are compared. They agree reasonably well, indicating that the challenge in the antenna technology for low-power high-speed 60-GHz wireless communications has been solved.