使用卡在故障模型:它工作得有多好?

ACM-SE 28 Pub Date : 1990-04-01 DOI:10.1145/98949.98968
A. A. Fennisi, D. Reeves
{"title":"使用卡在故障模型:它工作得有多好?","authors":"A. A. Fennisi, D. Reeves","doi":"10.1145/98949.98968","DOIUrl":null,"url":null,"abstract":"Many researchers have studied methods for both gen­ erating and simulating faults in CMOS chips. A good deal of focus has been on gate level modeling and test generation methods. The stuck at fault model and various derivations of it are still most widely used to generate test sets. Other researchers have demon­ strated the inappropriateness of the stuck at fault model for generating effective test sets for CMOS cir­ cuits. Among the fault types often missed are tran­ sistor faults, bridging faults and delay faults. In this paper a set of experiments are described to measure the effectiveness of gate level test generation methods on transistor faults. 1 I n t r o d u c t io n With the increasing densities of transistors being built onto single CMOS chips, the problem of detecting a faulty chip becomes more difficult, and the probabil­ ity of a faulty chip passing tests increases. Provided that the design phase of chip development is fault free, faults in a CMOS chip are the result of errors that oc­ cur in the fabrication process. These errors include extra or missing material on one or more of the lay­ ers built during fabrication. Researchers have studied the effects of these defects on circuit performance and classified them into different fault types[l]. 1 .1 T h e G a t e L e v e l M o d e l a n d T e s t in g Traditionally, tests for faults in the combinational por­ tion of a chip have been generated using the single line (node) stuck at fault model[2]. In this model, inputs and outputs of each logic gate (and, nand, inverter, etc.) are stimulated to produce the desired good out*This work wai supported by a grant from the Microelec­ tronics Center of North Carolina Permission to copy without fee all or part of this material is granted provided that the copies are not made or distributed for direct com­ mercial advantage, the ACM copyright notice and the title of the publication and its date appear, and notice Is given that copying Is by permission of the Association for Computing Machinery. To copy otherwise, or to republish, requires a fee and/or specific per­ mission. ©1990 ACM 0-89791-356-6/90/0400/0040 $1.50 put. In the faulty circuit, the value of a single input or output node is replaced with a logic value differ­ ent from the good circuit, thus indicating the stuck-at fault. The output of the faulty gate must then have the opposite logic value from the good circuit output to indicate the fault. For example, a three input nand gate has 8 stuck at faults in this model (see figurel). They are inputs, a, 6, and c, stuck at logic O(aaO) and stuck at logic l(sa /), and the output, z, stuck at 1 and stuck at 0. It is easy to see that if any of the inputs are stuck at 0, the output will always be a logic 1. Therefore, these faults, a sa0,b saO, c taO and z sal, fall into the same equivalence class and can all be detected by the same test: apply logic 1 to all inputs and observe a 0 on the output. If any of these faults are present, the output will be different (logic 1) from the good circuit (logic 0). The fault equivalence is not main­ tained when we reverse the logic values on the inputs and outputs, however. If input a sal, then to observe a difference on the output z we must apply, b—1, c=l, a=0, and observe output z=0 in the faulty gate; z=l in the unfaulty gate. Each of the inputs a, b, and c, must be tested individually; however a test for any in­ put sal will also detect output z saO. So, a total of four test vectors are needed to cover all the faults in the gate level model of a three input nand gate. We can apply the fault equivalence property to other gates in the circuit as well. In general, the tests needed to cover the faults for a particular gate may also cover the faults of other gates in that circuit. Using this in­ formation, equivalence fault collapsing is performed to determine a smaller number of faults that need to be covered in order to detect all the gate level faults in the circuit. When individual gates are connected together, test generation becomes more complicated. One cannot control directly the input to an embedded gate, nor can one observe directly the output of such a gate. So, testing a gate for faults involves stimulation of logic values on the input nodes (via outputs of gates occur­ ring before the gate in test) and propagation of the output node’s value (via gates occurring after the gale in test) to a circuit output. Various methods have been","PeriodicalId":409883,"journal":{"name":"ACM-SE 28","volume":"14 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1990-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Using the stuck-at fault model: how well does it work?\",\"authors\":\"A. A. Fennisi, D. Reeves\",\"doi\":\"10.1145/98949.98968\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Many researchers have studied methods for both gen­ erating and simulating faults in CMOS chips. A good deal of focus has been on gate level modeling and test generation methods. The stuck at fault model and various derivations of it are still most widely used to generate test sets. Other researchers have demon­ strated the inappropriateness of the stuck at fault model for generating effective test sets for CMOS cir­ cuits. Among the fault types often missed are tran­ sistor faults, bridging faults and delay faults. In this paper a set of experiments are described to measure the effectiveness of gate level test generation methods on transistor faults. 1 I n t r o d u c t io n With the increasing densities of transistors being built onto single CMOS chips, the problem of detecting a faulty chip becomes more difficult, and the probabil­ ity of a faulty chip passing tests increases. Provided that the design phase of chip development is fault free, faults in a CMOS chip are the result of errors that oc­ cur in the fabrication process. These errors include extra or missing material on one or more of the lay­ ers built during fabrication. Researchers have studied the effects of these defects on circuit performance and classified them into different fault types[l]. 1 .1 T h e G a t e L e v e l M o d e l a n d T e s t in g Traditionally, tests for faults in the combinational por­ tion of a chip have been generated using the single line (node) stuck at fault model[2]. In this model, inputs and outputs of each logic gate (and, nand, inverter, etc.) are stimulated to produce the desired good out*This work wai supported by a grant from the Microelec­ tronics Center of North Carolina Permission to copy without fee all or part of this material is granted provided that the copies are not made or distributed for direct com­ mercial advantage, the ACM copyright notice and the title of the publication and its date appear, and notice Is given that copying Is by permission of the Association for Computing Machinery. To copy otherwise, or to republish, requires a fee and/or specific per­ mission. ©1990 ACM 0-89791-356-6/90/0400/0040 $1.50 put. In the faulty circuit, the value of a single input or output node is replaced with a logic value differ­ ent from the good circuit, thus indicating the stuck-at fault. The output of the faulty gate must then have the opposite logic value from the good circuit output to indicate the fault. For example, a three input nand gate has 8 stuck at faults in this model (see figurel). They are inputs, a, 6, and c, stuck at logic O(aaO) and stuck at logic l(sa /), and the output, z, stuck at 1 and stuck at 0. It is easy to see that if any of the inputs are stuck at 0, the output will always be a logic 1. Therefore, these faults, a sa0,b saO, c taO and z sal, fall into the same equivalence class and can all be detected by the same test: apply logic 1 to all inputs and observe a 0 on the output. If any of these faults are present, the output will be different (logic 1) from the good circuit (logic 0). The fault equivalence is not main­ tained when we reverse the logic values on the inputs and outputs, however. If input a sal, then to observe a difference on the output z we must apply, b—1, c=l, a=0, and observe output z=0 in the faulty gate; z=l in the unfaulty gate. Each of the inputs a, b, and c, must be tested individually; however a test for any in­ put sal will also detect output z saO. So, a total of four test vectors are needed to cover all the faults in the gate level model of a three input nand gate. We can apply the fault equivalence property to other gates in the circuit as well. In general, the tests needed to cover the faults for a particular gate may also cover the faults of other gates in that circuit. Using this in­ formation, equivalence fault collapsing is performed to determine a smaller number of faults that need to be covered in order to detect all the gate level faults in the circuit. When individual gates are connected together, test generation becomes more complicated. One cannot control directly the input to an embedded gate, nor can one observe directly the output of such a gate. So, testing a gate for faults involves stimulation of logic values on the input nodes (via outputs of gates occur­ ring before the gate in test) and propagation of the output node’s value (via gates occurring after the gale in test) to a circuit output. Various methods have been\",\"PeriodicalId\":409883,\"journal\":{\"name\":\"ACM-SE 28\",\"volume\":\"14 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1990-04-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"ACM-SE 28\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1145/98949.98968\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"ACM-SE 28","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1145/98949.98968","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

摘要

许多研究者对CMOS芯片故障的产生和模拟方法进行了研究。大量的焦点集中在门级建模和测试生成方法上。卡在故障模型及其各种派生仍然是最广泛用于生成测试集的方法。其他研究人员已经证明了卡在故障模型不适用于生成CMOS电路的有效测试集。常见的故障类型有晶体管故障、桥接故障和延时故障。本文描述了一组实验来测量栅极电平测试生成方法对晶体管故障的有效性。随着单个CMOS芯片上晶体管密度的增加,检测故障芯片的问题变得更加困难,故障芯片通过测试的可能性也增加了。如果芯片开发的设计阶段是无故障的,则CMOS芯片中的故障是在制造过程中发生的错误的结果。这些错误包括在制造过程中在一个或多个层上多余或缺失的材料。研究者研究了这些缺陷对电路性能的影响,并将其划分为不同的故障类型[1]。1。1 T h e G T e L e v e L M o d e L n d T e s T G传统上,测试故障的组合运动,芯片已经生成的使用单一行(节点)被困在断层模型[2]。在这个模型中,每个逻辑门(和,nand,逆变器等)的输入和输出被刺激以产生期望的良好输出*本作品由北卡罗来纳微电子中心资助,允许免费复制本材料的全部或部分,前提是复制不是为了直接商业利益而制作或分发,ACM版权声明和出版物标题及其日期出现。并注明复制是由计算机协会许可的。以其他方式复制,或重新发布,需要费用和/或特定的任务。©1990 ACM 0-89791-356-6/90/0400/0040 1.50美元看跌期权。在故障电路中,单个输入或输出节点的值被替换为与正常电路不同的逻辑值,从而表示卡在故障。然后,故障门的输出必须具有与正常电路输出相反的逻辑值,以指示故障。例如,在这个模型中,一个三输入的与门有8个卡在故障上(见图)。它们是输入,a, 6和c,卡在逻辑0 (aaO)和逻辑1 (sa /),输出,z,卡在1和0。很容易看出,如果任何输入卡在0,输出将始终是逻辑上的1。因此,这些故障a sa0、b saO、c taO和z sal属于相同的等价类,并且都可以通过相同的测试来检测:对所有输入应用逻辑1,并观察输出上的a0。如果这些故障中的任何一个存在,输出将与正常电路(逻辑0)不同(逻辑1)。然而,当我们在输入和输出上反转逻辑值时,故障等效性不被维护。如果输入一个小,那么观察输出z上的差异,我们必须施加,b-1, c=l, a=0,并观察输出z=0在故障门;Z =l在无故障门。每个输入a、b和c必须单独测试;然而,对任何输入sal的测试也将检测输出zsao。因此,三输入与门的门级模型总共需要四个测试向量来覆盖所有的故障。我们也可以将故障等效特性应用到电路中的其他门上。一般来说,检测特定门的故障所需的测试也可能检测该电路中其他门的故障。利用这一信息,等效故障折叠被执行,以确定需要覆盖的较少数量的故障,以便检测电路中的所有门级故障。当各个门连接在一起时,测试生成变得更加复杂。人们不能直接控制嵌入式门的输入,也不能直接观察这种门的输出。因此,测试门的故障包括对输入节点上的逻辑值的刺激(通过门在测试中出现之前的输出)和输出节点值的传播(通过门在测试中出现之后)到电路输出。各种各样的方法
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Using the stuck-at fault model: how well does it work?
Many researchers have studied methods for both gen­ erating and simulating faults in CMOS chips. A good deal of focus has been on gate level modeling and test generation methods. The stuck at fault model and various derivations of it are still most widely used to generate test sets. Other researchers have demon­ strated the inappropriateness of the stuck at fault model for generating effective test sets for CMOS cir­ cuits. Among the fault types often missed are tran­ sistor faults, bridging faults and delay faults. In this paper a set of experiments are described to measure the effectiveness of gate level test generation methods on transistor faults. 1 I n t r o d u c t io n With the increasing densities of transistors being built onto single CMOS chips, the problem of detecting a faulty chip becomes more difficult, and the probabil­ ity of a faulty chip passing tests increases. Provided that the design phase of chip development is fault free, faults in a CMOS chip are the result of errors that oc­ cur in the fabrication process. These errors include extra or missing material on one or more of the lay­ ers built during fabrication. Researchers have studied the effects of these defects on circuit performance and classified them into different fault types[l]. 1 .1 T h e G a t e L e v e l M o d e l a n d T e s t in g Traditionally, tests for faults in the combinational por­ tion of a chip have been generated using the single line (node) stuck at fault model[2]. In this model, inputs and outputs of each logic gate (and, nand, inverter, etc.) are stimulated to produce the desired good out*This work wai supported by a grant from the Microelec­ tronics Center of North Carolina Permission to copy without fee all or part of this material is granted provided that the copies are not made or distributed for direct com­ mercial advantage, the ACM copyright notice and the title of the publication and its date appear, and notice Is given that copying Is by permission of the Association for Computing Machinery. To copy otherwise, or to republish, requires a fee and/or specific per­ mission. ©1990 ACM 0-89791-356-6/90/0400/0040 $1.50 put. In the faulty circuit, the value of a single input or output node is replaced with a logic value differ­ ent from the good circuit, thus indicating the stuck-at fault. The output of the faulty gate must then have the opposite logic value from the good circuit output to indicate the fault. For example, a three input nand gate has 8 stuck at faults in this model (see figurel). They are inputs, a, 6, and c, stuck at logic O(aaO) and stuck at logic l(sa /), and the output, z, stuck at 1 and stuck at 0. It is easy to see that if any of the inputs are stuck at 0, the output will always be a logic 1. Therefore, these faults, a sa0,b saO, c taO and z sal, fall into the same equivalence class and can all be detected by the same test: apply logic 1 to all inputs and observe a 0 on the output. If any of these faults are present, the output will be different (logic 1) from the good circuit (logic 0). The fault equivalence is not main­ tained when we reverse the logic values on the inputs and outputs, however. If input a sal, then to observe a difference on the output z we must apply, b—1, c=l, a=0, and observe output z=0 in the faulty gate; z=l in the unfaulty gate. Each of the inputs a, b, and c, must be tested individually; however a test for any in­ put sal will also detect output z saO. So, a total of four test vectors are needed to cover all the faults in the gate level model of a three input nand gate. We can apply the fault equivalence property to other gates in the circuit as well. In general, the tests needed to cover the faults for a particular gate may also cover the faults of other gates in that circuit. Using this in­ formation, equivalence fault collapsing is performed to determine a smaller number of faults that need to be covered in order to detect all the gate level faults in the circuit. When individual gates are connected together, test generation becomes more complicated. One cannot control directly the input to an embedded gate, nor can one observe directly the output of such a gate. So, testing a gate for faults involves stimulation of logic values on the input nodes (via outputs of gates occur­ ring before the gate in test) and propagation of the output node’s value (via gates occurring after the gale in test) to a circuit output. Various methods have been
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