低功耗和无热节流SSD与封装升压转换器用于1000-WL层3D闪存

Kazuma Hasegawa, Yuta Aiba, Xu Li, Hitomi Tanaka, T. Miyazaki, Hideko Mukaida, M. Koyanagi, Masayuki Miura, T. Sanuki
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引用次数: 0

摘要

由于ssd对更高性能的要求,3D闪存的功耗和热节流已经成为一个普遍的问题。其中一个主要原因是片上电荷泵电路,其转换效率低,产生热量高。由于组件的高密度安装,特别是在移动产品中,热量的产生成为一个关键问题。在这项工作中,我们制造了一个带有封装内升压转换器的3D闪存,以取代片上电荷泵电路。升压变换器由三种类型的分立元件组成:DC-DC变换器,电感器和电容器。使用封装内升压转换器,我们表明功耗可降低39%,而温升可降低50%。此外,当字线(WL)层数达到1000层时,可以实现高达43%的显著功耗降低,与传统的1xx层相比,功耗降低9%。所提出的封装内升压变换器是一种有效的抑制功耗和热量产生的方案,可以实现无热节流固态硬盘的开发。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Low Power and Thermal Throttling-less SSD with In-Package Boost Converter for 1000-WL Layer 3D Flash Memory
Power consumption and thermal throttling of the 3D flash memory have become a prevalent issue owing to the requirement for higher performance in SSDs. One of the main causes is the on-die charge pump circuit, which has a low conversion efficiency and induces high heat generation. The heat generation becomes a critical issue due to the high-density mounting of components, especially in mobile products. In this work, we fabricated a 3D flash memory with an in-package boost converter to replace the on-die charge pump circuit. The boost converter consists of three types of discrete components: a DC-DC converter, an inductor, and capacitors. Using the in package boost converter, we show that the power consumption can be reduced by up to 39% while the temperature rise can be reduced by 50%. Furthermore, when the number of word line (WL) layers reaches 1000, a significantly large power reduction up to 43% can be achieved, resulting in 9% smaller power consumption compared to the conventional 1xx layers. The proposed in-package boost converter is an effective scheme to suppress the power consumption and heat generation and can realize the development of a thermal throttling-less SSD.
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