0.18 um模块化三自对准嵌入式分栅闪存

R. Mih, J. Harrington, K. Houlihan, H. Lee, K. Chan, J. Johnson, Bomy Chen, Jiang Yan, A. Schmidt, C. Gruensfelder, Kisang Kim, D. Shum, C. Lo, D. Lee, A. Levi, C. Lam
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引用次数: 28

摘要

在0.18微米的高性能CMOS逻辑制程中嵌入了一个分栅快闪记忆体单元。一种新颖的三重自对准(SA3)工艺提供了紧凑的单元和高度的模块化。整个存储单元结构在小于13F/sup /的面积上用一个掩模定义。源侧通道热电子程序和多聚隧道擦除使低功耗适合低电压应用。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
0.18 um modular triple self-aligned embedded split-gate flash memory
A split-gate flash memory cell has been embedded in a 0.18 um high performance CMOS logic process with copper interconnects. A novel triple self-aligned (SA3) process provides a compact cell and high degree of modularity. The entire memory cell structure is defined with one single mask in an area less than 13F/sup 2/. Source-side channel hot electron program and poly-poly tunneling erase enable low power consumption suitable for low voltage applications.
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