铝摩尔分数对AlGaAs/GaAs HBT控制热行为的评价

C. Panchapakesan, J. Yuan
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引用次数: 0

摘要

分析了AlGaAs/GaAs HBT的热行为。热稳定性随Al摩尔分数的增加而提高。器件的导通电压随着摩尔分数的增加而增加,从而导致更少的功耗,从而更好的热稳定性。二维分析表明,与一维相比,由于它可以容纳热量的侧向耗散,因此温度大大降低。多发射极手指异质结晶体管在器件上表现出非均匀的温度分布。为了降低峰值温度,器件布局采用更窄的发射器和/或更宽的发射器之间的间距。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Evaluation of aluminum mole fraction for controlled thermal behavior of AlGaAs/GaAs HBT
The thermal behavior of AlGaAs/GaAs HBT was analyzed. The thermal stability improves with increasing Al mole fraction. The turn-on voltage of the device increases as the mole fraction which results in less power dissipation and hence better thermal stability. Two dimensional analysis shows much reduced temperatures compared to 1D since it accommodates the lateral dissipation of heat. Multi-emitter finger heterojunction transistor exhibits non-uniform temperature distribution across the device. To reduce the peak temperatures, device layouts with narrower emitters and/or wider spacing between the emitters are used.
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