运输包裹中的设备收费

B. Unger
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引用次数: 1

摘要

在运输包装中移动的设备会产生静电。在后续的操作或测试过程中,静电放电可能会导致设备故障。因此,用于封装半导体器件的材料应选择能够最大限度地减少充电和破坏性esd的材料。一些摩擦充电测试结果表明,其中一些器件封装导致了组装设施的故障率。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Device charging in shipping packages
Static charges can develop on devices with movement in shipping packages. During subsequent handling or testing operations, an ESD (electrostatic discharge) can result in device failure. Therefore, the materials used to package semiconductor devices should be selected for their ability to minimize charging and damaging ESDs. Some triboelectric charging test results are shown that suggest that some of these device packages contribute to the failure rate at the assembly facilities.
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