非接触式微系统新技术

sOc-EUSAI '05 Pub Date : 2005-10-12 DOI:10.1145/1107548.1107556

F. Vacherand

{"title":"非接触式微系统新技术","authors":"F. Vacherand","doi":"10.1145/1107548.1107556","DOIUrl":null,"url":null,"abstract":"This paper presents some new emerging technological avenues for contactless chips in order to tackle emerging and demanding future specifications. Basically RFID chips will evolve towards new embedded functions such as power, sensing and security.Today, R&D works on future contactless Microsystems can be clustered into four main directions:•• Silicon technologies for low power and non volatile memories• Contactless air interfaces• Embedded micro power sources• Embedded micro-sensors","PeriodicalId":391548,"journal":{"name":"sOc-EUSAI '05","volume":"358 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2005-10-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":"{\"title\":\"New technologies for contactless microsystems\",\"authors\":\"F. Vacherand\",\"doi\":\"10.1145/1107548.1107556\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper presents some new emerging technological avenues for contactless chips in order to tackle emerging and demanding future specifications. Basically RFID chips will evolve towards new embedded functions such as power, sensing and security.Today, R&D works on future contactless Microsystems can be clustered into four main directions:•• Silicon technologies for low power and non volatile memories• Contactless air interfaces• Embedded micro power sources• Embedded micro-sensors\",\"PeriodicalId\":391548,\"journal\":{\"name\":\"sOc-EUSAI '05\",\"volume\":\"358 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2005-10-12\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"4\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"sOc-EUSAI '05\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1145/1107548.1107556\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"sOc-EUSAI '05","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1145/1107548.1107556","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 4

摘要

本文介绍了一些新兴的非接触式芯片技术途径，以解决新兴的和苛刻的未来规范。基本上，RFID芯片将向新的嵌入式功能发展，如电源、传感和安全。今天，未来非接触式微系统的研发工作可以集中在四个主要方向:••低功耗和非易失性存储器的硅技术•非接触式空中接口•嵌入式微电源•嵌入式微传感器

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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New technologies for contactless microsystems

This paper presents some new emerging technological avenues for contactless chips in order to tackle emerging and demanding future specifications. Basically RFID chips will evolve towards new embedded functions such as power, sensing and security.Today, R&D works on future contactless Microsystems can be clustered into four main directions:•• Silicon technologies for low power and non volatile memories• Contactless air interfaces• Embedded micro power sources• Embedded micro-sensors

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来源期刊

sOc-EUSAI '05

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