辅修电子制造专业,重点是快速成型

P. T. Hulina, D. Landis
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引用次数: 1

摘要

本文描述了宾夕法尼亚州立大学的电子制造课程开发项目。本试点计划旨在结合本校电气工程系、工业与制造工程系及电子设计、通讯与计算中心的资源,提升工科本科生的设计与实务经验。电子工程系的课程和实验室支持电子电路设计和微电子处理,而电子工程系在印刷电路板组装方面拥有重要的专业知识和实验室设施,重点是表面贴装技术工艺。电子设计、通信和压缩中心(CEDCC)为快速电子系统设计和原型设计提供了支持基础设施,补充了EE和IE部门的项目。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
An electronics manufacturing minor in engineering with emphasis on rapid prototyping
This paper describes an Electronics Manufacturing curriculum development project at Penn State. This pilot project is intended to enhance the design and practical experiences of undergraduate engineering students by combining the resources of the Electrical Engineering Department, the Industrial and Manufacturing Engineering Department, and the Center for Electronic Design, Communications, and Computing (CEDCC). The EE Department curriculum and laboratories support electronic circuit design and microelectronic processing, while the IE Department has significant expertise and laboratory facilities in printed circuit board assembly with a strong emphasis on surface mount technology processes. The Center for Electronic Design, Communications, and Compacting (CEDCC) has in place a supporting infrastructure for rapid electronic system design and prototyping which complements both the EE and IE department programs.
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