多核设计的后硅调试

V. Bertacco
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引用次数: 4

摘要

由于现代处理器设计的日益复杂和生产时间表的缩短,已发布的硅中的逃逸错误数量正在增加。使问题更加恶化的是,芯片多处理器(cmp)具有复杂的、有时不确定的内存子系统,容易出现微妙的、毁灭性的错误。这种不断恶化的情况导致越来越多的验证工作转移到后硅,当最初的几个硬件原型可用时,验证实验直接在新制造的原型硬件上运行。虽然后硅验证能够在测试执行中实现更高的原始性能,但对于错误诊断和纠正来说,它是一个更具挑战性的环境。在这项工作中,我们简要概述了目前工业中使用的一些方法。然后,我们讨论了我们研究小组最近开发的一些想法,以利用后硅验证的性能优势,同时避开其低内部节点可观察性和昂贵的错误修复的局限性。最后,我们提出了一些当今后硅验证研究的一般趋势。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Post-silicon debugging for multi-core designs
Escaped errors in released silicon are growing in number due to the increasing complexity of modern processor designs and shrinking production schedules. Worsening the problem are recent trends towards chip multiprocessors (CMPs) with complex and sometimes non-deterministic memory subsystems prone to subtle, devastating bugs. This deteriorating situation is causing a growing portion of the validation effort to shift to post-silicon, when the first few hardware prototypes become available and where validation experiments are run directly on newly manufactured prototype hardware. While post-silicon validation enables much higher raw performance in test execution, it is a much more challenging environment for bug diagnosis and correction. In this work we briefly overview some of the current methodologies used in industry. We then discuss some recent ideas developed in our research group to leverage the performance advantage of post-silicon validation, while sidestepping its limitations of low internal node observability and expensive bug fixing. Finally we present some of today's general trends in post-silicon validation research.
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