微波光电二极管模块集成前置放大器集成电路使用倒装芯片键合技术

2002 International Topical Meeting on Microwave Photonics Pub Date : 1900-01-01 DOI:10.1109/MWP.2002.1158936

T. Hatta, T. Miyahara, N. Okada, K. Ota, M. Noda, S. Kaneko, H. Itamoto, N. Sekimoto, M. Ishizaki, E. Ishimura, M. Nakaji

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引用次数: 3

摘要

我们提出了一个光电二极管模块集成前置放大器集成电路使用一种新颖的倒装芯片键合技术。该波导光电二极管直接安装在InP异质双极晶体管集成电路上。

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Microwave photo-diode module integrated with a preamplifier IC using a flip-chip bonding technique

We propose a photo-diode module integrated with a pre-amplifier IC using a novel flip-chip bonding technique. An Au stud bump is used as a bonding material, and the waveguide photodiode is directly mounted on an InP hetero bipolar transistor IC.

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2002 International Topical Meeting on Microwave Photonics

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