{"title":"月球探测器的电子封装技术","authors":"A. Hawley, E. Klein, D. Lenhart, L. Shrum","doi":"10.1109/TPEP.1963.1136409","DOIUrl":null,"url":null,"abstract":". Several of the major packaging techniques and design methods used for electronics portions of the Surveyor spacecraft are presented. Descriptions are given of a typical electronic unit as it will appear on the spacecraft.","PeriodicalId":313371,"journal":{"name":"IEEE Transactions on Product Engineering and Production","volume":"54 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1963-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Electronic Packaging Techniques for Surveyor Lunar Spacecraft\",\"authors\":\"A. Hawley, E. Klein, D. Lenhart, L. Shrum\",\"doi\":\"10.1109/TPEP.1963.1136409\",\"DOIUrl\":null,\"url\":null,\"abstract\":\". Several of the major packaging techniques and design methods used for electronics portions of the Surveyor spacecraft are presented. Descriptions are given of a typical electronic unit as it will appear on the spacecraft.\",\"PeriodicalId\":313371,\"journal\":{\"name\":\"IEEE Transactions on Product Engineering and Production\",\"volume\":\"54 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1963-09-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE Transactions on Product Engineering and Production\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/TPEP.1963.1136409\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Product Engineering and Production","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/TPEP.1963.1136409","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Electronic Packaging Techniques for Surveyor Lunar Spacecraft
. Several of the major packaging techniques and design methods used for electronics portions of the Surveyor spacecraft are presented. Descriptions are given of a typical electronic unit as it will appear on the spacecraft.