{"title":"用于SiP系统的天线集成","authors":"W. Raedt, S. Brebels","doi":"10.1109/RWS.2014.6830146","DOIUrl":null,"url":null,"abstract":"New data communication applications are creating large numbers of new wireless devices with continuously more stringent requirements: smaller size, weight, higher frequencies and bandwidth and lower power consumption at an ever-decreasing cost. True RF systems-on-a-chip (SoC) remain however very difficult to realise since many passive components and particularly the antenna cannot be integrated in a cost effective way with sufficient quality or size on the same Si-die. Therefore, a systems-in-a-package (SiP) approach is required. In this overview paper several technology choices of integrated antennas for wireless systems ranging from microwave to mm-wave frequencies are discussed through integration examples of various wireless modules.","PeriodicalId":247495,"journal":{"name":"2014 IEEE Radio and Wireless Symposium (RWS)","volume":"125 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2014-06-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Antenna integration for SiP systems\",\"authors\":\"W. Raedt, S. Brebels\",\"doi\":\"10.1109/RWS.2014.6830146\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"New data communication applications are creating large numbers of new wireless devices with continuously more stringent requirements: smaller size, weight, higher frequencies and bandwidth and lower power consumption at an ever-decreasing cost. True RF systems-on-a-chip (SoC) remain however very difficult to realise since many passive components and particularly the antenna cannot be integrated in a cost effective way with sufficient quality or size on the same Si-die. Therefore, a systems-in-a-package (SiP) approach is required. In this overview paper several technology choices of integrated antennas for wireless systems ranging from microwave to mm-wave frequencies are discussed through integration examples of various wireless modules.\",\"PeriodicalId\":247495,\"journal\":{\"name\":\"2014 IEEE Radio and Wireless Symposium (RWS)\",\"volume\":\"125 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2014-06-12\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2014 IEEE Radio and Wireless Symposium (RWS)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/RWS.2014.6830146\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2014 IEEE Radio and Wireless Symposium (RWS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/RWS.2014.6830146","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
New data communication applications are creating large numbers of new wireless devices with continuously more stringent requirements: smaller size, weight, higher frequencies and bandwidth and lower power consumption at an ever-decreasing cost. True RF systems-on-a-chip (SoC) remain however very difficult to realise since many passive components and particularly the antenna cannot be integrated in a cost effective way with sufficient quality or size on the same Si-die. Therefore, a systems-in-a-package (SiP) approach is required. In this overview paper several technology choices of integrated antennas for wireless systems ranging from microwave to mm-wave frequencies are discussed through integration examples of various wireless modules.
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