{"title":"快速集成电路性能良率和分布预测使用旋转的电路参数主要元件","authors":"J. Horan, C. Lyden","doi":"10.1109/ESSDERC.1997.194512","DOIUrl":null,"url":null,"abstract":"Abstract Monte-Carlo techniques for prediction of IC yield in the presence of inter-die parameter variations are well established in the literature [Luigi P. Monte-Carlo simulation of semiconductor device and process modelling; critical review. IEEE Trans CAD 1990; CAD-9: 1164--76], but their use in commercial design is limited by their high computational cost. This paper presents a novel technique which shows a great reduction in the simulation cost and sustains the accuracy. It does this by first using Principal Component Analysis (PCA) [Cureton EE et al. Factor analysis: an applied approach. Hillsdale, New Jersey: Laurence Erlbaum Associates, 1983] to identify the significant orthogonal directions of variation in the process space. The next steps involve the development of an accurate approximation of the two dimensional yield boundary. Finally, an analytic integration in the process space provides the yield. The steps involved in the yield calculation also conveniently produce performance distributions and this is described.","PeriodicalId":424167,"journal":{"name":"27th European Solid-State Device Research Conference","volume":"83 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1997-09-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Rapid IC Performance Yield and distribution prediction using a rotation of the circuit parameter principals components\",\"authors\":\"J. Horan, C. Lyden\",\"doi\":\"10.1109/ESSDERC.1997.194512\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Abstract Monte-Carlo techniques for prediction of IC yield in the presence of inter-die parameter variations are well established in the literature [Luigi P. Monte-Carlo simulation of semiconductor device and process modelling; critical review. IEEE Trans CAD 1990; CAD-9: 1164--76], but their use in commercial design is limited by their high computational cost. This paper presents a novel technique which shows a great reduction in the simulation cost and sustains the accuracy. It does this by first using Principal Component Analysis (PCA) [Cureton EE et al. Factor analysis: an applied approach. Hillsdale, New Jersey: Laurence Erlbaum Associates, 1983] to identify the significant orthogonal directions of variation in the process space. The next steps involve the development of an accurate approximation of the two dimensional yield boundary. Finally, an analytic integration in the process space provides the yield. The steps involved in the yield calculation also conveniently produce performance distributions and this is described.\",\"PeriodicalId\":424167,\"journal\":{\"name\":\"27th European Solid-State Device Research Conference\",\"volume\":\"83 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1997-09-22\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"27th European Solid-State Device Research Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ESSDERC.1997.194512\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"27th European Solid-State Device Research Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ESSDERC.1997.194512","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
摘要
摘要:蒙特卡罗技术在存在芯片间参数变化的情况下预测IC良率在文献中已经很好地建立[Luigi P.半导体器件的蒙特卡罗模拟和工艺建模;关键的审查。IEEE Trans CAD 1990;CAD-9: 1164—76],但它们在商业设计中的应用受到其高计算成本的限制。本文提出了一种新颖的方法,大大降低了仿真成本,并保持了仿真的准确性。它首先使用主成分分析(PCA) [Cureton EE等人]来做到这一点。因子分析:一种实用的方法。Hillsdale, New Jersey: Laurence Erlbaum Associates, 1983]来确定过程空间中变化的显著正交方向。接下来的步骤涉及二维屈服边界的精确近似的发展。最后,通过过程空间的解析积分给出了良率。在良率计算中涉及的步骤也方便地产生性能分布,这是描述。
Rapid IC Performance Yield and distribution prediction using a rotation of the circuit parameter principals components
Abstract Monte-Carlo techniques for prediction of IC yield in the presence of inter-die parameter variations are well established in the literature [Luigi P. Monte-Carlo simulation of semiconductor device and process modelling; critical review. IEEE Trans CAD 1990; CAD-9: 1164--76], but their use in commercial design is limited by their high computational cost. This paper presents a novel technique which shows a great reduction in the simulation cost and sustains the accuracy. It does this by first using Principal Component Analysis (PCA) [Cureton EE et al. Factor analysis: an applied approach. Hillsdale, New Jersey: Laurence Erlbaum Associates, 1983] to identify the significant orthogonal directions of variation in the process space. The next steps involve the development of an accurate approximation of the two dimensional yield boundary. Finally, an analytic integration in the process space provides the yield. The steps involved in the yield calculation also conveniently produce performance distributions and this is described.