用VHDL-AMS和SPICE建模比较Al和Cu互连

2016 2nd International Conference on Contemporary Computing and Informatics (IC3I) Pub Date : 2016-12-01 DOI:10.1109/IC3I.2016.7918031

Saurabh Chaturvedi, M. Božanić, S. Sinha

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引用次数: 1

摘要

本文比较了铝微带线和铜微带线结构的瞬态特性。互连用分布电阻-电感-电容(RLC)传输线(TL)模型表示。首先利用VHDL-AMS实现了Al和Cu互连的等效rlc阶梯网络，并比较了它们的时域仿真响应。为了验证VHDL-AMS实现的结果，使用SPICE建模重复了该过程。两者的仿真结果吻合较好。

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Comparison of Al and Cu interconnects using VHDL-AMS and SPICE modeling

This paper compares the transient characteristics of aluminum (Al) and copper (Cu) microstrip line structures. Interconnects are represented using distributed resistance inductance capacitance (RLC) transmission line (TL) model. The equivalent RLC-ladder networks for Al and Cu interconnects are first implemented using VHDL-AMS, and their time-domain simulation responses are compared. For the verification of the results obtained from VHDL-AMS implementation, the process is repeated with SPICE modeling. Both the simulation results are in good agreement.

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2016 2nd International Conference on Contemporary Computing and Informatics (IC3I)

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