456Gbps高速陶瓷封装在光通信中的应用

Proceedings of the 2022 9th International Conference on Wireless Communication and Sensor Networks Pub Date : 2022-01-11 DOI:10.1145/3514105.3514131

Huizeng Yan, Huanbei Chen, Hao Zhou, Qiushi Liang

{"title":"456Gbps高速陶瓷封装在光通信中的应用","authors":"Huizeng Yan, Huanbei Chen, Hao Zhou, Qiushi Liang","doi":"10.1145/3514105.3514131","DOIUrl":null,"url":null,"abstract":"A high-speed ceramic package based on High-temperature cofired ceramics (HTCC) process is presented in this paper. The traditional differential vias structure is replaced by face via structure at the signal transmission port. By analyzing its equivalent circuit model and simulating in frequency domain, the port can realize single channel high-speed signal transmission with 40GHz bandwidth on the premise of ensuring signal integrity. The cylinder via structure and face via structure under the same conditions are analyzed in frequency domain and time domain. It is verified that the face via structure has better transmission characteristics and can more effectively ensure the signal integrity. Finally, the structure is applied to the four-channel package of Optical module, which can support high-speed signal transmission above 4 × 56Gbps.","PeriodicalId":360718,"journal":{"name":"Proceedings of the 2022 9th International Conference on Wireless Communication and Sensor Networks","volume":"55 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2022-01-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"456Gbps High-speed Ceramic Package Applied to Optical Communication\",\"authors\":\"Huizeng Yan, Huanbei Chen, Hao Zhou, Qiushi Liang\",\"doi\":\"10.1145/3514105.3514131\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A high-speed ceramic package based on High-temperature cofired ceramics (HTCC) process is presented in this paper. The traditional differential vias structure is replaced by face via structure at the signal transmission port. By analyzing its equivalent circuit model and simulating in frequency domain, the port can realize single channel high-speed signal transmission with 40GHz bandwidth on the premise of ensuring signal integrity. The cylinder via structure and face via structure under the same conditions are analyzed in frequency domain and time domain. It is verified that the face via structure has better transmission characteristics and can more effectively ensure the signal integrity. Finally, the structure is applied to the four-channel package of Optical module, which can support high-speed signal transmission above 4 × 56Gbps.\",\"PeriodicalId\":360718,\"journal\":{\"name\":\"Proceedings of the 2022 9th International Conference on Wireless Communication and Sensor Networks\",\"volume\":\"55 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2022-01-11\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of the 2022 9th International Conference on Wireless Communication and Sensor Networks\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1145/3514105.3514131\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the 2022 9th International Conference on Wireless Communication and Sensor Networks","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1145/3514105.3514131","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 0

摘要

介绍了一种基于高温共烧陶瓷(HTCC)工艺的高速陶瓷封装。在信号传输口采用面通孔结构代替传统的差动通孔结构。通过对其等效电路模型的分析和频域仿真，可以在保证信号完整性的前提下，实现40GHz带宽的单通道高速信号传输。对相同条件下的圆柱通孔结构和面通孔结构进行了频域和时域分析。验证了面通结构具有更好的传输特性，能更有效地保证信号的完整性。最后，将该结构应用于光模块的四通道封装，可支持4 × 56Gbps以上的高速信号传输。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文本刊更多论文

456Gbps High-speed Ceramic Package Applied to Optical Communication

A high-speed ceramic package based on High-temperature cofired ceramics (HTCC) process is presented in this paper. The traditional differential vias structure is replaced by face via structure at the signal transmission port. By analyzing its equivalent circuit model and simulating in frequency domain, the port can realize single channel high-speed signal transmission with 40GHz bandwidth on the premise of ensuring signal integrity. The cylinder via structure and face via structure under the same conditions are analyzed in frequency domain and time domain. It is verified that the face via structure has better transmission characteristics and can more effectively ensure the signal integrity. Finally, the structure is applied to the four-channel package of Optical module, which can support high-speed signal transmission above 4 × 56Gbps.

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

Proceedings of the 2022 9th International Conference on Wireless Communication and Sensor Networks

自引率

0.00%

发文量