非破坏性近场显微技术表征碳化硅结构

Kuan-Ting Wu, E. Vuillermet, Elise Usureau, Y. El-Helou, M. Kazan, W. Woon, M. Lazar, A. Bruyant
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引用次数: 0

摘要

在4H-SiC衬底上沉积了SiC溅射层和电子束蒸发层。通过1400℃和1700℃两个高原高温退火试验了再结晶。通过非破坏性近场显微镜技术系统地研究了结晶度,特别适用于我们的薄层。仅在电子束蒸发层和较高的退火平台后,通过保留4H衬底多型,才证实了良好的再结晶。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
SiC structural characterization by non destructive near-field microscopy techniques
SiC sputtered and e-beam evaporated layers have been deposited on 4H-SiC substrates. Recrystallization has been tried by high temperature annealing with two plateaus at 1400°C and 1700°C. The crystallinity was systematically investigated by non destructive near-field microscopy techniques, particularly adapted to the thin thickness of our layers. Good recrystallization is confirmed only on the e-beam evaporated layers and after the higher annealing plateau by preserving 4H substrate polytype.
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