新型高频层压板中传输线的特性

2016 IEEE 7th Latin American Symposium on Circuits & Systems (LASCAS) Pub Date : 2016-02-01 DOI:10.1109/LASCAS.2016.7451092

A. Perez-Fajardo, D. M. Cortés-Hernández, R. Torres‐Torres, A. Torres-Jácome

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引用次数: 0

摘要

本文提出了一种高频层压板中传输线(TL)的表征方法。该方法在基于聚四氟乙烯的新型PCB层压板中进行，用于低导体粗糙度(hrms)和低损耗正切(tanδ)的高频应用。为了应用表征方法，在微带互连中，s参数高达30 GHz。通过时域仿真对模型进行了验证，与实验结果吻合较好。

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Characterization of transmission lines in a novel high-frequency laminate

In this work a method for characterization of transmission line (TL) in high-frequency laminates is proposed. The method is performed in a novel PCB laminate based in PTFE for high-frequency applications with low conductor roughness (hrms) and low loss tangent (tanδ). In order to apply the characterization method, S-parameters were taken up to 30 GHz in a microstrip interconnect. Time domain simulation was performed to validate the model, showing good agreement with experimental results.

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来源期刊

2016 IEEE 7th Latin American Symposium on Circuits & Systems (LASCAS)

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