大批量制造65nm CMOS数字工艺中的温度传感器设计

D. Duarte, G. Geannopoulos, U. Mughal, Keng L. Wong, G. Taylor
{"title":"大批量制造65nm CMOS数字工艺中的温度传感器设计","authors":"D. Duarte, G. Geannopoulos, U. Mughal, Keng L. Wong, G. Taylor","doi":"10.1109/CICC.2007.4405718","DOIUrl":null,"url":null,"abstract":"Thermal management (TM) allows the system architect to design a cooling solution based on real-life power consumption, not peak power. The on-die thermal sensor circuit, as the core of the TM system, monitors the on-die junction temperature (Tj). We present a novel high-linearity thermal sensor topology with built-in circuit support for correction of systematic shifts in the transfer function correction. Results obtained on the 65 nm Pentiumreg4 processor demonstrate the feasibility and effectiveness of the design.","PeriodicalId":130106,"journal":{"name":"2007 IEEE Custom Integrated Circuits Conference","volume":"45 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2007-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"55","resultStr":"{\"title\":\"Temperature Sensor Design in a High Volume Manufacturing 65nm CMOS Digital Process\",\"authors\":\"D. Duarte, G. Geannopoulos, U. Mughal, Keng L. Wong, G. Taylor\",\"doi\":\"10.1109/CICC.2007.4405718\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Thermal management (TM) allows the system architect to design a cooling solution based on real-life power consumption, not peak power. The on-die thermal sensor circuit, as the core of the TM system, monitors the on-die junction temperature (Tj). We present a novel high-linearity thermal sensor topology with built-in circuit support for correction of systematic shifts in the transfer function correction. Results obtained on the 65 nm Pentiumreg4 processor demonstrate the feasibility and effectiveness of the design.\",\"PeriodicalId\":130106,\"journal\":{\"name\":\"2007 IEEE Custom Integrated Circuits Conference\",\"volume\":\"45 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2007-09-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"55\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2007 IEEE Custom Integrated Circuits Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/CICC.2007.4405718\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2007 IEEE Custom Integrated Circuits Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/CICC.2007.4405718","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 55

摘要

热管理(TM)允许系统架构师根据实际功耗(而不是峰值功率)设计冷却解决方案。片上热传感器电路作为TM系统的核心,监测片上结温(Tj)。我们提出了一种新颖的高线性热传感器拓扑结构,其内置电路支持在传递函数校正中校正系统移位。在65nm Pentiumreg4处理器上的实验结果验证了该设计的可行性和有效性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Temperature Sensor Design in a High Volume Manufacturing 65nm CMOS Digital Process
Thermal management (TM) allows the system architect to design a cooling solution based on real-life power consumption, not peak power. The on-die thermal sensor circuit, as the core of the TM system, monitors the on-die junction temperature (Tj). We present a novel high-linearity thermal sensor topology with built-in circuit support for correction of systematic shifts in the transfer function correction. Results obtained on the 65 nm Pentiumreg4 processor demonstrate the feasibility and effectiveness of the design.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信