供电高速接口的ESD性能评估

2015 IEEE International Symposium on Electromagnetic Compatibility (EMC) Pub Date : 2015-09-14 DOI:10.1109/ISEMC.2015.7256322

Sebastian Koch, H. Gossner, H. Gieser, L. Maurer

{"title":"供电高速接口的ESD性能评估","authors":"Sebastian Koch, H. Gossner, H. Gieser, L. Maurer","doi":"10.1109/ISEMC.2015.7256322","DOIUrl":null,"url":null,"abstract":"An approach towards evaluating the ESD performance of high-speed interfaces is presented. By applying ESD stress to powered USB 3.0 interfaces the propagation of very short ESD pulses is investigated. Soft failures caused by TLP stress are put into relation to hard failure thresholds of the unpowered devices as well as soft failures induced by IEC 61000-4-2 pulses.","PeriodicalId":412708,"journal":{"name":"2015 IEEE International Symposium on Electromagnetic Compatibility (EMC)","volume":"107 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2015-09-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"ESD performance evaluation of powered high-speed interfaces\",\"authors\":\"Sebastian Koch, H. Gossner, H. Gieser, L. Maurer\",\"doi\":\"10.1109/ISEMC.2015.7256322\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"An approach towards evaluating the ESD performance of high-speed interfaces is presented. By applying ESD stress to powered USB 3.0 interfaces the propagation of very short ESD pulses is investigated. Soft failures caused by TLP stress are put into relation to hard failure thresholds of the unpowered devices as well as soft failures induced by IEC 61000-4-2 pulses.\",\"PeriodicalId\":412708,\"journal\":{\"name\":\"2015 IEEE International Symposium on Electromagnetic Compatibility (EMC)\",\"volume\":\"107 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2015-09-14\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2015 IEEE International Symposium on Electromagnetic Compatibility (EMC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISEMC.2015.7256322\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2015 IEEE International Symposium on Electromagnetic Compatibility (EMC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISEMC.2015.7256322","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 3

摘要

提出了一种评价高速接口ESD性能的方法。通过对USB 3.0接口施加ESD应力，研究了极短ESD脉冲的传播。TLP应力引起的软失效与无动力器件的硬失效阈值以及IEC 61000-4-2脉冲引起的软失效有关。

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ESD performance evaluation of powered high-speed interfaces

An approach towards evaluating the ESD performance of high-speed interfaces is presented. By applying ESD stress to powered USB 3.0 interfaces the propagation of very short ESD pulses is investigated. Soft failures caused by TLP stress are put into relation to hard failure thresholds of the unpowered devices as well as soft failures induced by IEC 61000-4-2 pulses.

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2015 IEEE International Symposium on Electromagnetic Compatibility (EMC)

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