T2SL的优势:来自IRnova的生产和新发展

L. Höglund, C. Asplund, R. Marcks von Würtemberg, A. Gamfeldt, H. Kataria, D. Lantz, S. Smuk, E. Costard, H. Martijn
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引用次数: 16

摘要

自2014年以来,IRnova一直在生产基于InAs/GaSb ii型超晶格(T2SL)的中波红外(MWIR)探测器。本文介绍了采用ISC9705读出集成电路(ROIC)生产的320 × 256像素、30 μm间距的MWIR焦平面阵列(fpa)第一年的可操作性、时空噪声等效温差(NETD)和其他关键生产参数的结果。T2SL探测器的图像稳定性结果表明,图像质量不会随着时间的推移而下降。结果表明,即使在重复的探测器温度循环后,非均匀性校正仍然保持稳定。在f/2光学和8 ms积分时间下,制备中波阵列的时间和空间NETD分别为12 mK和4 mK。在较大的场景温度下,空间噪声仍然小于时间噪声的60%。此外,采用ISC0403 ROIC的间距为15 μm的640 x 512中波fpa正在进入工业化阶段。在f/4光学和22 ms积分时间下,获得的时空NETD值分别为25 mK和10 mK,可操作性为99.85%。本文介绍了用于短波、中波和长波红外波长区域的T2SL探测器的最新发展情况,并介绍了更高工作温度、更小间距和更大FPA格式的最新发展。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Advantages of T2SL: results from production and new development at IRnova
IRnova has been manufacturing mid wave infrared (MWIR) detectors based on InAs/GaSb type-II superlattices (T2SL) since 2014. Results from the first years of production of MWIR focal plane arrays (FPAs) with 320 x 256 pixels on 30 μm pitch using the ISC9705 readout integrated circuit (ROIC) is presented in terms of operability, temporal and spatial noise equivalent temperature difference (NETD) and other key production parameters. Results on image stability of T2SL detectors show that no deterioration of image quality over time can be observed. Furthermore it is shown that the non-uniformity correction remains stable even after repeated detector temperature cycles. Spatial and temporal NETD for fabricated mid wave arrays show a temporal NETD of 12 mK and a spatial NETD of 4 mK with f/2 optics and 8 ms integration time. When studied over a large scene temperature, the spatial noise is still less than 60 % of the temporal noise. Furthermore, 640 x 512 mid wave FPAs with 15 μm pitch using the ISC0403 ROIC are entering an industrialization phase. Temporal and spatial NETD values of 25 mK and 10 mK, respectively, are obtained with f/4 optics and 22 ms integration time and the operability is 99.85 %. A status update on the development of T2SL detectors for short wave, mid wave and long wave infrared wavelength regions for existing and new applications is given and recent development towards higher operating temperature, smaller pitch and larger FPA formats is presented.
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