利用瞬态哈曼技术表征薄膜ZT

Z. Bian, Yan Zhang, Holger Schmidt, Ali Shakouri
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引用次数: 12

摘要

薄膜热电材料由于可以自由地调整电子和热输运,为改善热电性能ZT提供了巨大的潜力。由于衬底、非理想接触和三维器件结构不对称共存,这些薄膜的表征是困难的。我们从理论上和实验上研究了测量硅衬底上薄膜Si/SiGe超晶格ZT的瞬态哈曼方法。三维电热模拟使我们能够确定薄膜和衬底对瞬态响应的贡献。在测量方面,使用高速封装和电阻抗匹配可以显著改善短时间内的振铃和噪声。焦耳加热对热电动势的贡献是通过双极测量从珀耳帖热量中分离出来的。变厚度超晶格法可以消除触点和衬底的寄生非理想效应。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Thin film ZT characterization using transient Harman technique
Thin-film thermoelectric materials offer great potential for improving the thermoelectric figure of merit ZT due to the freedom of tailoring the electron and heat transport. The characterization of these thin films is difficult because of the coexistence of the substrate, non-ideal contact, and asymmetric three-dimensional device structure. We have investigated theoretically and experimentally the transient Harman method for measuring the ZT of a thin film Si/SiGe superlattices on a silicon substrate. 3D electrothermal simulations allow us to identify the contribution of the thin film and the substrate to the transient response. On the measurement side, ringing at short times and noise can be significantly improved by using high-speed packages and electrical impedance matching. The Joule heating contribution to the thermoelectric EMF is separated from the Peltier one by the bipolar measurement. The parasitic non-ideal effects of contacts and substrate can be removed by variable thickness superlattice method.
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