平面SOC设计的增量物理设计方法

Li-Yi Lin, Hsin-chang Lin, Shih-Arn Hwang
{"title":"平面SOC设计的增量物理设计方法","authors":"Li-Yi Lin, Hsin-chang Lin, Shih-Arn Hwang","doi":"10.1109/VDAT.2009.5158167","DOIUrl":null,"url":null,"abstract":"SOC designs for consumer electronics often evolve generation by generation in a very short time. Besides the needs for merging more functionality, more and more enhancements are for the purpose of interface upgrading for new standards and better or faster signal processing hardware engines for video/audio encoding and decoding. Physical designs for these kinds of enhanced chips can reuse large potions of the previous layout and do not need to be re-implemented from the ground up to shorten the time to market. However, traditional physical incremental design method is becoming impractical, especially for the flat design, which usually can has the advantage of the smaller die size compared with the hierarchical design. In this paper, we propose an incremental physical design method to take the advantages of the hieratical design while maintaining the cost strength in the flat design. Our proposed method has been successfully applied to our next generation multimedia chip and the results show that no design iteration is needed and the run time is at least 5 times faster compared with the traditional method.","PeriodicalId":246670,"journal":{"name":"2009 International Symposium on VLSI Design, Automation and Test","volume":"9 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2009-04-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Incremental physical design method for flat SOC design\",\"authors\":\"Li-Yi Lin, Hsin-chang Lin, Shih-Arn Hwang\",\"doi\":\"10.1109/VDAT.2009.5158167\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"SOC designs for consumer electronics often evolve generation by generation in a very short time. Besides the needs for merging more functionality, more and more enhancements are for the purpose of interface upgrading for new standards and better or faster signal processing hardware engines for video/audio encoding and decoding. Physical designs for these kinds of enhanced chips can reuse large potions of the previous layout and do not need to be re-implemented from the ground up to shorten the time to market. However, traditional physical incremental design method is becoming impractical, especially for the flat design, which usually can has the advantage of the smaller die size compared with the hierarchical design. In this paper, we propose an incremental physical design method to take the advantages of the hieratical design while maintaining the cost strength in the flat design. Our proposed method has been successfully applied to our next generation multimedia chip and the results show that no design iteration is needed and the run time is at least 5 times faster compared with the traditional method.\",\"PeriodicalId\":246670,\"journal\":{\"name\":\"2009 International Symposium on VLSI Design, Automation and Test\",\"volume\":\"9 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2009-04-28\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2009 International Symposium on VLSI Design, Automation and Test\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/VDAT.2009.5158167\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2009 International Symposium on VLSI Design, Automation and Test","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/VDAT.2009.5158167","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2

摘要

消费类电子产品的SOC设计通常在很短的时间内一代又一代地发展。除了合并更多功能的需求外,越来越多的增强是为了升级接口以适应新标准,以及更好或更快的信号处理硬件引擎,用于视频/音频编码和解码。这类增强芯片的物理设计可以重用之前布局的大部分内容,而不需要从头开始重新实现,从而缩短上市时间。然而,传统的物理增量设计方法正变得越来越不实用,特别是对于平面设计而言,与分层设计相比,这种方法通常具有更小的模具尺寸的优点。在本文中,我们提出了一种增量物理设计方法,在保持平面设计成本强度的同时,利用分层设计的优势。该方法已成功应用于我们的下一代多媒体芯片,结果表明,该方法无需重复设计,运行时间比传统方法快至少5倍。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Incremental physical design method for flat SOC design
SOC designs for consumer electronics often evolve generation by generation in a very short time. Besides the needs for merging more functionality, more and more enhancements are for the purpose of interface upgrading for new standards and better or faster signal processing hardware engines for video/audio encoding and decoding. Physical designs for these kinds of enhanced chips can reuse large potions of the previous layout and do not need to be re-implemented from the ground up to shorten the time to market. However, traditional physical incremental design method is becoming impractical, especially for the flat design, which usually can has the advantage of the smaller die size compared with the hierarchical design. In this paper, we propose an incremental physical design method to take the advantages of the hieratical design while maintaining the cost strength in the flat design. Our proposed method has been successfully applied to our next generation multimedia chip and the results show that no design iteration is needed and the run time is at least 5 times faster compared with the traditional method.
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