{"title":"车载控制器PCB板热力耦合性能分析与研究","authors":"Yajuan Chen","doi":"10.1109/ICEDME50972.2020.00090","DOIUrl":null,"url":null,"abstract":"Based on the basic theory of thermodynamics and finite element, taking PCB of as the research object of a vehicle controller, the thermal characteristics and structural mechanics simulation are carried out. The distribution of temperature, thermal stress and deformation and thermal-force coupling performance of PCB are obtained, so as to provide a reference for the design optimization of the subsequent circuit board, the selection of heat dissipation mode and the installation position.","PeriodicalId":155375,"journal":{"name":"2020 3rd International Conference on Electron Device and Mechanical Engineering (ICEDME)","volume":"45 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2020-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Analysis and Research on Thermal-Force Coupling Performance of a Vehicle Controller PCB Board\",\"authors\":\"Yajuan Chen\",\"doi\":\"10.1109/ICEDME50972.2020.00090\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Based on the basic theory of thermodynamics and finite element, taking PCB of as the research object of a vehicle controller, the thermal characteristics and structural mechanics simulation are carried out. The distribution of temperature, thermal stress and deformation and thermal-force coupling performance of PCB are obtained, so as to provide a reference for the design optimization of the subsequent circuit board, the selection of heat dissipation mode and the installation position.\",\"PeriodicalId\":155375,\"journal\":{\"name\":\"2020 3rd International Conference on Electron Device and Mechanical Engineering (ICEDME)\",\"volume\":\"45 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2020-05-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2020 3rd International Conference on Electron Device and Mechanical Engineering (ICEDME)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICEDME50972.2020.00090\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2020 3rd International Conference on Electron Device and Mechanical Engineering (ICEDME)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICEDME50972.2020.00090","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Analysis and Research on Thermal-Force Coupling Performance of a Vehicle Controller PCB Board
Based on the basic theory of thermodynamics and finite element, taking PCB of as the research object of a vehicle controller, the thermal characteristics and structural mechanics simulation are carried out. The distribution of temperature, thermal stress and deformation and thermal-force coupling performance of PCB are obtained, so as to provide a reference for the design optimization of the subsequent circuit board, the selection of heat dissipation mode and the installation position.
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