几何形状对矩形IC封装分层影响的断裂力学分析

2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220) Pub Date : 2001-05-29 DOI:10.1109/ECTC.2001.927793

A. Tay, H. Zhu

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引用次数: 3

摘要

本文对塑料集成电路封装中封装几何形状对分层的影响进行了数值研究。对外径尺寸为9.7 mm/spl times/4.4 mm/spl times/ 1mm、模垫尺寸为5.5 mm/spl times/ 3mm -0.125 mm的TSSOP (Thin Shrink Small Outline Package)进行了一套全面的线弹性有限元断裂分析。采用虚拟裂纹闭合法计算了衬垫-密封剂界面边缘小裂纹尖端的应变能释放率(ERR)。进行了参数分析。除其他因素外，发现模具和模具垫之间的边界大小对ERR的影响最大。如果这个边界大于0.8 mm, ERR或多或少与模具的长度无关。这一发现对包装设计非常有用。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Fracture mechanics analysis of the effect of geometry on delaminations in rectangular IC packages

This paper describes a numerical study the effect of package geometry on delaminations in plastic IC packages. A comprehensive set of linear elastic, finite element fracture analyses were carried out on a TSSOP (Thin Shrink Small Outline Package) with outer dimensions 9.7 mm/spl times/4.4 mm/spl times/1 mm and die pad dimensions 5.5 mm/spl times/3 mm -0.125 mm. The virtual crack closure method was used to calculate the strain energy release rate (ERR) at the tip of a small crack at the edge of the pad-encapsulant interface. A parametric analysis was carried out. Among other things, it was found that the size of the border between the die and the die pad had the greatest influence on the ERR. If this border was greater than 0.8 mm the ERR became more or less independent of the length of the die. This finding should be very useful for packaging design.

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2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220)

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