{"title":"利用二维位移场测量焊锡-铜界面断裂参数","authors":"H. Tippur, H. Krishnamoorthy","doi":"10.1115/imece1997-1230","DOIUrl":null,"url":null,"abstract":"\n Moiré interferometry is used for mapping elasto-plastic deformations in 63/37 solder-copper bimaterials subjected to predominantly tensile loading. A method for quantifying the fracture parameter — the J-integral — using full-field measurement of u2-displacements has been developed. A linear relationship between crack tip opening displacements (CTOD) and the J-integral is demonstrated. The crack growth resistance curve and hence crack initiation toughness JC for the bimaterial is obtained. Full-field optical information has also suggested the possibility of using a simpler method for the J-integral estimation using a single strain gage.","PeriodicalId":230568,"journal":{"name":"Applications of Experimental Mechanics to Electronic Packaging","volume":"318 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1997-11-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Measurement of Solder-Copper Interfacial Fracture Parameters Using u2-Displacement Fields\",\"authors\":\"H. Tippur, H. Krishnamoorthy\",\"doi\":\"10.1115/imece1997-1230\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"\\n Moiré interferometry is used for mapping elasto-plastic deformations in 63/37 solder-copper bimaterials subjected to predominantly tensile loading. A method for quantifying the fracture parameter — the J-integral — using full-field measurement of u2-displacements has been developed. A linear relationship between crack tip opening displacements (CTOD) and the J-integral is demonstrated. The crack growth resistance curve and hence crack initiation toughness JC for the bimaterial is obtained. Full-field optical information has also suggested the possibility of using a simpler method for the J-integral estimation using a single strain gage.\",\"PeriodicalId\":230568,\"journal\":{\"name\":\"Applications of Experimental Mechanics to Electronic Packaging\",\"volume\":\"318 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1997-11-16\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Applications of Experimental Mechanics to Electronic Packaging\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1115/imece1997-1230\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Applications of Experimental Mechanics to Electronic Packaging","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1115/imece1997-1230","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Measurement of Solder-Copper Interfacial Fracture Parameters Using u2-Displacement Fields
Moiré interferometry is used for mapping elasto-plastic deformations in 63/37 solder-copper bimaterials subjected to predominantly tensile loading. A method for quantifying the fracture parameter — the J-integral — using full-field measurement of u2-displacements has been developed. A linear relationship between crack tip opening displacements (CTOD) and the J-integral is demonstrated. The crack growth resistance curve and hence crack initiation toughness JC for the bimaterial is obtained. Full-field optical information has also suggested the possibility of using a simpler method for the J-integral estimation using a single strain gage.
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