高性能cmos器件开发指南

S. Kimura
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引用次数: 0

摘要

在ULSI(超大规模集成)中使用的主要硅器件被认为可能是CMOS(互补金属氧化物半导体)器件,除了直流有限区域,双极器件可能生存,甚至大型计算机的高性能cpu(中央处理单元)也将被CMOS所取代,因为CMOS器件可以满足降低功耗,提高性能和降低成本的严格要求,同时保持高集成能力。然而,CMOS器件并不完美,性能的提高受到一些物理现象的限制,如短通道效应、载流子速度饱和和电阻/电容增加。我们使用分析模型对cmos器件进行性能评估,其中考虑了载流子速度饱和,扩散层电阻和电容以及迁移率退化等因素,该分析建议了器件结构应该是什么。然后,描述了提高性能的必要措施,最后介绍了制造的CMOS器件的特性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Guidelines for high-performance CMOS-devices development
The dominant silicon devices used in ULSI (Ultra Large Scale Integration) are considered likely to be CMOS (Complementary Metal Oxide Semiconductor) devices, except for dc limited areas in, which bipolar devices may survive, Even high performance CPUs (Central Processing Units) of mainframe computers are going to be replaced by CMOS, because CMOS devices can meet severe requirements for power reduction, performance improvement and cost reduction, while maintaining a high integration capability. However, CMOS devices are not perfect, and performance improvements are constrained by several physical phenomena such as the short-channel-effects, carrier velocity saturation, and resistance/capacitance increase. We perform CMOS-device performance evaluation using an analytical model, in which carrier velocity saturation, diffusion-layer resistance and capacitance, and mobility degradation etc. are taken into consideration, This analysis suggests what the device structures should be. Then, several measures necessary for performance improvements are described, and finally characteristics of the fabricated CMOS devices are introduced.
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