{"title":"涂层Cu板ENIG接头的可靠性研究","authors":"H. Nishikawa, Jianhao Wang, K. Kariya, N. Masago","doi":"10.1109/ECTC32696.2021.00093","DOIUrl":null,"url":null,"abstract":"To meet the increasing demand of the next-generation power conversion circuit on the high-power density, high operating temperature and miniaturization, many novel packaging methods have been investigation. Due to high remelting temperature and low cost transient liquid phase (TLP) bonding technology shows the great potential. In this paper, ENIG-finished Cu disks were bonded by In-coated Cu sheet through TLP bonding at 250°C and the shear test as well as fracture analysis during thermal aging was conducted. The bonded joint with the Cu2In, Au-In-Cu and Ni2In3IMC interface showed a strength of 19.85 MPa, although some defects could be observed. During thermal aging, the Cu2In and Ni2In3coarsened and the interface became more compact. It was very interesting that the shear strength of joint was increased by 81.21 after 1008 h thermal aging at 250°C. Although the fracture location was changed during thermal aging, the fracture surface always showed brittle characteristics.","PeriodicalId":351817,"journal":{"name":"2021 IEEE 71st Electronic Components and Technology Conference (ECTC)","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2021-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"The reliability of ENIG joint bonded by In-coated Cu sheet\",\"authors\":\"H. Nishikawa, Jianhao Wang, K. Kariya, N. Masago\",\"doi\":\"10.1109/ECTC32696.2021.00093\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"To meet the increasing demand of the next-generation power conversion circuit on the high-power density, high operating temperature and miniaturization, many novel packaging methods have been investigation. Due to high remelting temperature and low cost transient liquid phase (TLP) bonding technology shows the great potential. In this paper, ENIG-finished Cu disks were bonded by In-coated Cu sheet through TLP bonding at 250°C and the shear test as well as fracture analysis during thermal aging was conducted. The bonded joint with the Cu2In, Au-In-Cu and Ni2In3IMC interface showed a strength of 19.85 MPa, although some defects could be observed. During thermal aging, the Cu2In and Ni2In3coarsened and the interface became more compact. It was very interesting that the shear strength of joint was increased by 81.21 after 1008 h thermal aging at 250°C. Although the fracture location was changed during thermal aging, the fracture surface always showed brittle characteristics.\",\"PeriodicalId\":351817,\"journal\":{\"name\":\"2021 IEEE 71st Electronic Components and Technology Conference (ECTC)\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2021-06-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2021 IEEE 71st Electronic Components and Technology Conference (ECTC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ECTC32696.2021.00093\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2021 IEEE 71st Electronic Components and Technology Conference (ECTC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTC32696.2021.00093","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
摘要
为了满足下一代功率转换电路对高功率密度、高工作温度和小型化日益增长的要求,人们研究了许多新的封装方法。瞬态液相(TLP)键合技术由于重熔温度高、成本低而显示出巨大的发展潜力。本文采用In-coated Cu sheet在250℃下通过TLP焊接enigg -finished Cu disks,并进行了剪切试验和热时效过程中的断裂分析。与Cu2In、Au-In-Cu和Ni2In3IMC界面结合的接头强度为19.85 MPa,但存在一定缺陷。在热时效过程中,Cu2In和ni2in3晶粒变粗,界面变得更加致密。在250℃热时效1008 h后,接头的抗剪强度提高了81.21倍。在热时效过程中,虽然断口位置发生了变化,但断口表面始终呈现脆性特征。
The reliability of ENIG joint bonded by In-coated Cu sheet
To meet the increasing demand of the next-generation power conversion circuit on the high-power density, high operating temperature and miniaturization, many novel packaging methods have been investigation. Due to high remelting temperature and low cost transient liquid phase (TLP) bonding technology shows the great potential. In this paper, ENIG-finished Cu disks were bonded by In-coated Cu sheet through TLP bonding at 250°C and the shear test as well as fracture analysis during thermal aging was conducted. The bonded joint with the Cu2In, Au-In-Cu and Ni2In3IMC interface showed a strength of 19.85 MPa, although some defects could be observed. During thermal aging, the Cu2In and Ni2In3coarsened and the interface became more compact. It was very interesting that the shear strength of joint was increased by 81.21 after 1008 h thermal aging at 250°C. Although the fracture location was changed during thermal aging, the fracture surface always showed brittle characteristics.