一种带有陶瓷芯片耦合器的电小型印刷反f天线

Eunjoo Kim, H. Ryu, J. Woo
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引用次数: 0

摘要

本文通过加载陶瓷芯片耦合器实现了一种用于蓝牙应用的印刷反f天线(IFA)的小型化。该芯片耦合器由陶瓷(εr=21)芯片表面的波纹线组成。与普通印刷IFA相比,采用芯片耦合器的印刷IFA降低了64.9%。天线的尺寸为35.1 mm3。−10db带宽测量为90mhz(3.68%)。测得的辐射方向图在yz平面和xy平面上呈全向分布。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
An electrically small printed inverted-F antenna with a ceramic chip coupler
In this paper a printed inverted-F antenna (IFA) is miniaturized by loading a ceramic chip coupler for bluetooth applications. The chip coupler is composed of printed meander lines on surfaces of the ceramic (εr=21) chip. The proposed printed IFA with the chip coupler is reduced up to 64.9 % compared with a general printed IFA. The size of antenna is a volume of 35.1 mm3. The −10 dB bandwidth was measured as 90 MHz (3.68 %). The measured radiation pattern shows omnidirectional patterns in the yz plane and xy plane.
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