硅陶瓷基板功率放大器模块的热建模与测量

2018 11th German Microwave Conference (GeMiC) Pub Date : 2018-03-12 DOI:10.23919/GEMIC.2018.8335033

A. Frank, V. Cortes, S. Michael, A. Hagelauer, G. Fischer

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引用次数: 0

摘要

在本文中，通过热有限元建模和在PCB模块上的测量，研究了功率放大器在印刷电路板(PCB)和低温共烧陶瓷模块上的热行为。通过谐波平衡仿真和测量，确定了热对放大器性能和功耗的影响。在此基础上，进行了SiCer验证系统的集成设计。

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Thermal modeling and measurement of a power amplifier module for a silicon-ceramic substrate

In the present paper, the thermal behavior of a power amplifier on a printed circuit board (PCB) and in a low-temperature co-fired ceramics module is examined by thermal FE modelling and measurements on the PCB module. The thermal impact on the performance of the PA and its power dissipation are determined by harmonic balance simulation and measurements. Based on these simulations, an integrated design of a demonstrator system on SiCer is pursued.

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2018 11th German Microwave Conference (GeMiC)

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