{"title":"基于球碰撞技术的三维堆叠电路匹配电路设计","authors":"Yin-hua Yao, Tong-xiu Fan","doi":"10.1109/ICCMC.2017.8282538","DOIUrl":null,"url":null,"abstract":"This paper elaborates the matching design of 3D board-stacked transmission circuit between up and down layers using ball bumping technology. The S parameters of transmission circuit at DC-20GHz derived from HFSS simulation are applied to the matching circuit design in ADS (Advanced Design System) Software. Thereafter, the obtained model of transmission circuit with matching circuit is created and simulated in HFSS. In addition, the effect of bumping technological parameters, including ball radius, horizontal shifts of ball center, and space between two boards, on S11 and S22, are discussed. Finally, grounded balls instead of metal cavity are adopted to shield the circuit.","PeriodicalId":163288,"journal":{"name":"2017 International Conference on Computing Methodologies and Communication (ICCMC)","volume":"31 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2017-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Matching circuit design of 3D stacked circuit based on ball bumping technology\",\"authors\":\"Yin-hua Yao, Tong-xiu Fan\",\"doi\":\"10.1109/ICCMC.2017.8282538\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper elaborates the matching design of 3D board-stacked transmission circuit between up and down layers using ball bumping technology. The S parameters of transmission circuit at DC-20GHz derived from HFSS simulation are applied to the matching circuit design in ADS (Advanced Design System) Software. Thereafter, the obtained model of transmission circuit with matching circuit is created and simulated in HFSS. In addition, the effect of bumping technological parameters, including ball radius, horizontal shifts of ball center, and space between two boards, on S11 and S22, are discussed. Finally, grounded balls instead of metal cavity are adopted to shield the circuit.\",\"PeriodicalId\":163288,\"journal\":{\"name\":\"2017 International Conference on Computing Methodologies and Communication (ICCMC)\",\"volume\":\"31 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2017-07-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2017 International Conference on Computing Methodologies and Communication (ICCMC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICCMC.2017.8282538\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2017 International Conference on Computing Methodologies and Communication (ICCMC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICCMC.2017.8282538","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Matching circuit design of 3D stacked circuit based on ball bumping technology
This paper elaborates the matching design of 3D board-stacked transmission circuit between up and down layers using ball bumping technology. The S parameters of transmission circuit at DC-20GHz derived from HFSS simulation are applied to the matching circuit design in ADS (Advanced Design System) Software. Thereafter, the obtained model of transmission circuit with matching circuit is created and simulated in HFSS. In addition, the effect of bumping technological parameters, including ball radius, horizontal shifts of ball center, and space between two boards, on S11 and S22, are discussed. Finally, grounded balls instead of metal cavity are adopted to shield the circuit.
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