电子-声子输运对金属-非金属界面热阻的影响

J. Goicochea, B. Michel
{"title":"电子-声子输运对金属-非金属界面热阻的影响","authors":"J. Goicochea, B. Michel","doi":"10.1109/STHERM.2011.5767193","DOIUrl":null,"url":null,"abstract":"In this work, we study the impact of the phonon thermal conductivity of Silver (Ag) and Gold (Au) on the interface resistance of metal-nonmetal contacts at room temperature. The thermal conductivity of both metals is determined for bulk and thin films of varying thickness using non-equilibrium molecular dynamics (NEMD) simulations. Likewise, we determine the thermal interface resistance due to phonons of metal films embedded in a nonmetal layer composed of Silicon (Si). Based on a two-temperature model (TTM) for electrons and phonons, we determine the thermal resistance due to electron-phonon interactions and the variation of the film resistance of Ag and Au layers as a function of their thickness. The latter considering the estimated phonon contribution to the thermal conductivity of the studied metals obtained with our NEMD simulations. Two important results are presented in this work. First, we have found for the studied metals that at room temperature phonons contribute less than 1.0 % to the bulk thermal conductivity; and that their relative contribution to the conductivity and its variation with the film thickness significantly impacts the overall film resistance of metallic films.","PeriodicalId":128077,"journal":{"name":"2011 27th Annual IEEE Semiconductor Thermal Measurement and Management Symposium","volume":"32 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2011-03-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"6","resultStr":"{\"title\":\"Impact of electron-phonon transport on the thermal resistance of metal-nonmetal interfaces\",\"authors\":\"J. Goicochea, B. Michel\",\"doi\":\"10.1109/STHERM.2011.5767193\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this work, we study the impact of the phonon thermal conductivity of Silver (Ag) and Gold (Au) on the interface resistance of metal-nonmetal contacts at room temperature. The thermal conductivity of both metals is determined for bulk and thin films of varying thickness using non-equilibrium molecular dynamics (NEMD) simulations. Likewise, we determine the thermal interface resistance due to phonons of metal films embedded in a nonmetal layer composed of Silicon (Si). Based on a two-temperature model (TTM) for electrons and phonons, we determine the thermal resistance due to electron-phonon interactions and the variation of the film resistance of Ag and Au layers as a function of their thickness. The latter considering the estimated phonon contribution to the thermal conductivity of the studied metals obtained with our NEMD simulations. Two important results are presented in this work. First, we have found for the studied metals that at room temperature phonons contribute less than 1.0 % to the bulk thermal conductivity; and that their relative contribution to the conductivity and its variation with the film thickness significantly impacts the overall film resistance of metallic films.\",\"PeriodicalId\":128077,\"journal\":{\"name\":\"2011 27th Annual IEEE Semiconductor Thermal Measurement and Management Symposium\",\"volume\":\"32 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2011-03-20\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"6\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2011 27th Annual IEEE Semiconductor Thermal Measurement and Management Symposium\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/STHERM.2011.5767193\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2011 27th Annual IEEE Semiconductor Thermal Measurement and Management Symposium","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/STHERM.2011.5767193","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 6

摘要

本文研究了室温下银(Ag)和金(Au)的声子热导率对金属-非金属触点界面电阻的影响。利用非平衡分子动力学(NEMD)模拟,确定了两种金属的导热性。同样,我们确定了由于金属薄膜声子嵌入由硅(Si)组成的非金属层而引起的热界面电阻。基于电子和声子的双温度模型(TTM),我们确定了由于电子-声子相互作用引起的热阻,以及Ag和Au层的薄膜电阻随厚度的变化。后者考虑估计声子对研究金属的导热性的贡献,通过我们的NEMD模拟获得。在这项工作中提出了两个重要的结果。首先,我们发现在所研究的金属中,在室温下声子对体热导率的贡献小于1.0%;它们对电导率的相对贡献及其随薄膜厚度的变化显著影响金属薄膜的整体薄膜电阻。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Impact of electron-phonon transport on the thermal resistance of metal-nonmetal interfaces
In this work, we study the impact of the phonon thermal conductivity of Silver (Ag) and Gold (Au) on the interface resistance of metal-nonmetal contacts at room temperature. The thermal conductivity of both metals is determined for bulk and thin films of varying thickness using non-equilibrium molecular dynamics (NEMD) simulations. Likewise, we determine the thermal interface resistance due to phonons of metal films embedded in a nonmetal layer composed of Silicon (Si). Based on a two-temperature model (TTM) for electrons and phonons, we determine the thermal resistance due to electron-phonon interactions and the variation of the film resistance of Ag and Au layers as a function of their thickness. The latter considering the estimated phonon contribution to the thermal conductivity of the studied metals obtained with our NEMD simulations. Two important results are presented in this work. First, we have found for the studied metals that at room temperature phonons contribute less than 1.0 % to the bulk thermal conductivity; and that their relative contribution to the conductivity and its variation with the film thickness significantly impacts the overall film resistance of metallic films.
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