带缺陷接地结构的半圆F槽多带微带天线分析

2018 Recent Advances on Engineering, Technology and Computational Sciences (RAETCS) Pub Date : 2018-02-01 DOI:10.1109/RAETCS.2018.8443929

Mukesh Kumar, R. Saxena, J. A. Ansari, Ajay Kumar Singh, M. G. Siddiqui, A. K. Saroj, G. Singh

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引用次数: 1

摘要

提出了一种具有缺陷接地结构的半圆形F槽多带微带贴片天线。对于两种不同的衬底材料(Fr-4和teflon)，天线尺寸为39.6 × 24.6 × 1.6 mm3。利用ANSoft HFSS对天线的回波损耗、驻波比和辐射方向图等性能进行了仿真分析。该天线谐振频率为3.4 GHz、6GHz和8.25 GHz, S、C和X频段阻抗带宽分别为2.35%、2.58%和3.15%;谐振频率为2.5 GHz、4.45 GHz、5.15 GHz和6.15 GHz, Fr-4基板S和C频段阻抗带宽分别为3.2%、4.26%、2.52%和3.98%。

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Analysis of Half Circular F Slot Multiband Microstrip Antenna with Defected Ground Structure

A half circular F slot multiband microstrip patch antenna (MSA) with defected ground structure (DGS) presented through this paper. The dimension of proposed antenna is 39.6 × 24.6 × 1.6 mm3 for two different substrate materials (Fr-4 andTeflon). The performance analysis of proposed antenna characteristics such as return loss, VSWR and radiation pattern has simulated using ANSoft HFSS. This antenna has resonated at frequencies 3.4 GHz, 6GHz and 8.25 GHz with impedance bandwidth 2.35%,2.58% and 3.15% respectively lies in S, C and X band for Teflon base substrate, and resonated at frequencies 2.5 GHz, 4.45 GHz, 5.15 GHz and 6.15 GHz operated with impedance bandwidth3.2%, 4.26%, 2.52% and 3.98% in S and C bands respectively for Fr-4 substrate.

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来源期刊

2018 Recent Advances on Engineering, Technology and Computational Sciences (RAETCS)

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