化学镀Ni - UBM与95.5Sn-4.0Ag-0.5Cu合金的界面反应研究

52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345) Pub Date : 2002-08-07 DOI:10.1109/ECTC.2002.1008180

Young-Doo Jeon, S. Nieland, A. Ostmann, H. Reichl, K. Paik

{"title":"化学镀Ni - UBM与95.5Sn-4.0Ag-0.5Cu合金的界面反应研究","authors":"Young-Doo Jeon, S. Nieland, A. Ostmann, H. Reichl, K. Paik","doi":"10.1109/ECTC.2002.1008180","DOIUrl":null,"url":null,"abstract":"Even though electroless Ni and Sn-Ag-Cu solder are widely used materials in electronic packaging applications, interfacial reactions of the ternary Ni-Cu-Sn system have not been known well because of their complexity. Because the growth of intermetallics at the interface affects reliability of solder joint, the intermetallics in Ni-Cu-Sn system should be identified, and their growth should be investigated. Therefore, in present study, interfacial reactions between electroless Ni UBM and 95.5Sn-4.0Ag-0.5Cu alloy were investigated focusing on morphology of the IMCs, thermodynamics, and growth kinetics.","PeriodicalId":285713,"journal":{"name":"52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345)","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2002-08-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"9","resultStr":"{\"title\":\"Studies on the interfacial reactions between electroless Ni UBM and 95.5Sn-4.0Ag-0.5Cu alloy\",\"authors\":\"Young-Doo Jeon, S. Nieland, A. Ostmann, H. Reichl, K. Paik\",\"doi\":\"10.1109/ECTC.2002.1008180\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Even though electroless Ni and Sn-Ag-Cu solder are widely used materials in electronic packaging applications, interfacial reactions of the ternary Ni-Cu-Sn system have not been known well because of their complexity. Because the growth of intermetallics at the interface affects reliability of solder joint, the intermetallics in Ni-Cu-Sn system should be identified, and their growth should be investigated. Therefore, in present study, interfacial reactions between electroless Ni UBM and 95.5Sn-4.0Ag-0.5Cu alloy were investigated focusing on morphology of the IMCs, thermodynamics, and growth kinetics.\",\"PeriodicalId\":285713,\"journal\":{\"name\":\"52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345)\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2002-08-07\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"9\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ECTC.2002.1008180\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTC.2002.1008180","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 9

摘要

尽管化学镀镍和Sn-Ag-Cu焊料是电子封装应用中广泛使用的材料，但由于其复杂性，三元Ni- cu - sn体系的界面反应尚未得到很好的了解。由于金属间化合物在界面处的生长会影响焊点的可靠性，因此需要识别Ni-Cu-Sn体系中的金属间化合物，并对其生长进行研究。因此，本研究主要研究了化学镀Ni - UBM与95.5Sn-4.0Ag-0.5Cu合金的界面反应，重点研究了IMCs的形貌、热力学和生长动力学。

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Studies on the interfacial reactions between electroless Ni UBM and 95.5Sn-4.0Ag-0.5Cu alloy

Even though electroless Ni and Sn-Ag-Cu solder are widely used materials in electronic packaging applications, interfacial reactions of the ternary Ni-Cu-Sn system have not been known well because of their complexity. Because the growth of intermetallics at the interface affects reliability of solder joint, the intermetallics in Ni-Cu-Sn system should be identified, and their growth should be investigated. Therefore, in present study, interfacial reactions between electroless Ni UBM and 95.5Sn-4.0Ag-0.5Cu alloy were investigated focusing on morphology of the IMCs, thermodynamics, and growth kinetics.

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52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345)

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