3db多层支路耦合器中电磁带隙的开发

N. M. Jizat, Z. Yusoff, S. Rahim, M. Sabran, M. Islam
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引用次数: 6

摘要

高载波频率、宽带、设备密度、唯一号码、普遍高速率覆盖和无缝用户体验驱动的先进转变是未来5G空中接口和频谱与LTE一起在通信世界中正在经历爆炸式增长。本文介绍了将电磁带隙集成到设计中的多层槽耦合3db分支线耦合器(BLC)的性能改进。所提出的BLC在Rogers RT/duroid 5880上进行了仿真,其介电常数为3.38,设计工作频率为7 GHz。采用单平面紧凑型电磁带隙(UC-EBG)结构作为槽耦合地,减少了辐射元件之间的相互耦合,实现了更高的工作谐振频率。电磁带隙的周期性结构由于其优异的表面波抑制性能,在射频微波工业中得到了广泛的研究。所提出的BLC的模拟耦合和传输值分别为3.12和4.04 dB。当与EBG槽耦合地平面集成时,BLC的阻抗带宽(BW)显著提高到120%。采用耦合技术,在多层微带槽技术中实现了BLC的设计。最终,这些应用将产生广泛的操作带宽,其中BLC将作为未来5G无线通信的关键波束形成网络元件。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Exploitation of the electromagnetic band gap (EBG) in 3-dB multi-layer branch-line coupler
An advanced shift that driven with high carrier frequencies, wide bandwidths, device densities, unique numbers, universal high-rate coverage and a seamless user experience present future 5G air interface and spectrum together with LTE is currently experiencing an explosive growth in the communication world. This letter presents performance improvement of multi-layer slot coupled 3 dB Branch-Line Coupler (BLC) with the integration of electromagnetic band gap into the design. The proposed BLC is simulated on a Rogers RT/duroid 5880 with permittivity of 3.38 and designed to operate at 7 GHz. A configuration of uniplanar compact electromagnetic band-gap (UC-EBG) structures is exploited to serve as a slot coupled ground to reduce mutual coupling between the radiating elements and to achieve a higher operating resonance frequency. The periodic structure of electromagnetic band gap (EBG) is considered in RF-microwave industry due to their extraordinary surface wave suppression property. The proposed BLC delivered simulated coupling and transmission values of 3.12 and 4.04 dB, respectively. The impedance bandwidths (BW) of the BLC significantly increase to 120% when integrated with an EBG slot coupled ground plane. The proposed BLC design was accomplished in multilayer microstrip-slot technology by employing coupling technique. Ultimately, these applications produce wide operational bandwidth in which the BLC will serves as an essential key beam forming network element for future 5G wireless communications.
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