多元时间序列异常检测的集成机器学习算法

Youssef Trardi, B. Ananou, Philip Tchatchoua, M. Ouladsine
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引用次数: 1

摘要

本文提出了一种基于多变换技术和集成机器学习(EML)算法的多元时间序列异常检测方法。目的是在半导体制造过程中检测异常晶圆的存在。因此,我们评估了一组从中间制造链衍生的11个特征来表征晶圆状态。每个特征的数据记录在150秒的时间框架内。为了解决大规模数据处理的计算复杂性,一个降维步骤是非常必要的。事实上,独立成分分析(ICA)、主成分分析(PCA)和因子分析(FA)被用于比较目的。同时,从每个特征序列中提取最重要的成分,并构建一个完全组合的特征子集。其次,将EML算法中最流行的一种进化方法——决策树、自举聚合、增强,拟合到得到的特征上,以定义最佳的异常检测排序。所选模型使用7000个样本(即晶圆片)进行验证,其中5000个正常样本和2000个异常样本。结果突出了该方法的优势,该方法可以作为半导体制造过程中异常晶圆检测的有价值的决策支持。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Ensemble Machine Learning Algorithms for Anomaly Detection in Multivariate Time-Series
This paper proposes a multivariate time-series anomaly detection approach using multiple transform techniques and ensemble machine learning (EML) algorithms. The objective is to detect the presence of abnormal wafers during the semiconductor manufacturing process. Therefore, we evaluate a set of eleven features derived from an intermediate manufacturing chain to characterize the wafer status. Data from each feature is recorded over a 150-second time frame. To address the computational complexity of large-scale data processing, a dimensionality reduction step is highly desirable. Indeed, independent component analysis (ICA), principal component analysis (PCA), and factor analysis (FA) are used for comparison purposes. As well, to extract the most significant components from each feature sequence and build a thoroughly combined subset of characteristics. In the sequel, decision trees, bootstrap aggregating, boosting, one of the prevalent evolutions of EML algorithms, are fitted to the obtained characteristics to define the best anomaly detection ranking. The selected model is validated using 7000 samples (i.e. wafers) divided into 5000 normal samples and 2000 abnormal samples. The results highlight the strengths of the proposed approach, which could serve as a valuable decision-making support for abnormal wafer detection in the semiconductor manufacturing process.
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