一种22nm FD-SOI CMOS 2路d波段功率放大器,利用自适应后门偏置技术在9.6dBm OP1dB下实现7.7%的PAE,在6dB下实现3.1%的PAE

Elham Rahimi, Farhad Bozorgi, G. Hueber
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引用次数: 1

摘要

本文提出了一种采用22nm FD-SOI技术的2路3级d波段功率放大器(PA)。提出了一种动态三级偏置标度技术。它是基于利用CMOS FD-SOI技术中的后门终端来优化每个级的功耗以适应PA的输入功率,从而提高其在线性范围内的整体PAE,即在OP1dB和功率回退时。在芯面积为0.16mm 2的模具上制作了PA。测量了扩音芯片的小信号和大信号特性。在1V电源电压和135GHz频率下,它提供14.2dB的功率增益,分别具有20GHz和52GHz的3db和6db带宽。测量结果表明,与CMOS技术中最先进的d波段放大器相比,该放大器在9.6 dBm OP1dB和6dB回退时的PAE分别达到7.7%和3.1%,分别提高了>1.5倍和>2倍。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A 22nm FD-SOI CMOS 2-way D-band Power Amplifier Achieving PAE of 7.7% at 9.6dBm OP1dB and 3.1% at 6dB Back-off by Leveraging Adaptive Back-Gate Bias Technique
This work presents a 2-way 3-stage D-band Power Amplifier (PA) in 22nm FD-SOI technology. A dynamic 3-stage bias scaling technique is proposed for this PA. It is based on leveraging the back-gate terminal in CMOS FD-SOI technology to optimize the power consumption of each stage adaptive to the input power of the PA, and hence improve its overall PAE in the linear range, i.e. at OP1dB and power back-off. The PA has been fabricated on a die with the core area of 0.16mm 2. Small signal and large signal characteristics of the PA chip have been measured. At 1V supply voltage and frequency of 135GHz, it provides 14.2dB power gain with 20GHz and 52GHz 3-dB and 6-dB bandwidth, respectively. Measurement results show this PA achieves 7.7% and 3.1% PAE at 9.6 dBm OP1dB and 6dB back-off that features >1.5X and >2X improvement, respectively, compared to the state-of-the-art D-band PAs in CMOS technologies.
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