单片微波集成电路技术及系统应用

J. Pan
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引用次数: 1

摘要

GaAs单片微波集成电路(MMIC)和Gb/s逻辑的最新进展为许多未来的系统应用奠定了坚实的基础。受益于这些进步的系统包括相控/自适应阵列、军事卫星通信、电视仅接收(TVRO)接收器、电子战(EW)、仪表和雷达。本文介绍了各种MMIC技术和材料的权衡(晶体生长,取向,材料性质,表征技术等),工艺(离子注入,分子束外延,气相外延,液相外延),以及通过孔,气桥,有源匹配等电路制造。总结了目前已实现的超高频/超高频MMIC的性能。本文还介绍了MMIC设计和制造的技术问题、可能的解决方案和未来趋势(阻抗匹配方法、偏置、低噪声技术、中功率IC、EHF电路、滤波器、隔离器、封装技术等)。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Monolithic Microwave IC Technologies and System Applications
Recent progress of GaAs Monolithic Microwave Integrated Circuit (MMIC) and Gb/s logic has established a solid foundation for many future system applications. Systems benefiting from these advances include phased/adaptive arrays, MILSATCOM, Television Receive-Only (TVRO) receiver, Electronic Warfare (EW), instrumentation and radar. This paper presents various MMIC technologies and tradeoffs of materials (crystal growths, orientations, material properties, characterization techniques, etc.), processes (ion-implantation, Molecular Beam Epitaxy, Vapor Phase Epitaxy, Liquid Phase Epitaxy), and circuit fabrication via hole, air bridge, active matching, etc. The performance of the presently achieved SHF/EHF MMIC's are summarized. Technical problems, possible solutions, and future trends of MMIC design and fabrication (impedance matching methods, bias, low noise techniques, medium power IC's, EHF circuits, filters, isolators, packaging techniques, etc.) are also described.
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